Patents by Inventor Richard P. Randall

Richard P. Randall has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sound damping wallboard and method of forming a sound damping wallboard
    Patent number: 11939765
    Abstract: A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard comprises a gypsum layer with a gypsum surface having an encasing layer. The encasing layer is partially removed to expose the gypsum surface and form a gypsum surface portion and a first encasing layer portion on the gypsum layer. A sound damping layer is applied to the gypsum layer to cover at least part of the gypsum surface portion and the encasing layer portion.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: March 26, 2024
    Assignee: Gold Bond Building Products, LLC
    Inventors: Michael N. Blades, John M. Watt, John E. Yakowenko, Todd D. Broud, Keith R. O'Leary, Stephen A. Cusa, Mauricio Quiros, Brian G. Randall, Richard P. Weir
  • Repulpable pressure-sensitive adhesive compositions
    Patent number: 5536787
    Abstract: A water-dispersible, inherently tacky pressure-sensitive adhesive comprising a tacky emulsion polymer formed of from about 80% to 90% by weight of monomers comprising a major portion of at least alkyl acrylate containing from 4 to about 8 carbon atoms in the alkyl group and from about 20% to 10% by weight of a mixture of acrylic acid with at least an oleophilic unsaturated carboxylic acid, said emulsion polymer formed in the presence of anionic and nonionic surfactants to provide a polymer having a glass transition temperature of -15.degree. to -50.degree. C. A sufficient amount of chain transfer agent is employed to provide an emulsion polymer which when coated on a repulpable paper substrate enables recovery of paper fibers substantially free of adhesive under conditions of TAPPI Useful Method 213 and/or 204, and resistant to loss of adhesive properties on exposure to high humidity.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 16, 1996
    Assignee: Avery Dennison Corporation
    Inventors: William F. Scholz, Robert H. Van Ham, Richard P. Randall
  • Repulpable pressure-sensitive adhesive compositions
    Patent number: 5536800
    Abstract: A water-dispersible, inherently tacky pressure-sensitive adhesive comprising a tacky emulsion polymer formed of from about 80% to 90% by weight of monomers comprising a major portion of at least alkyl acrylate containing from 4 to about 8 carbon atoms in the alkyl group and from about 20% to 10% by weight of a mixture of acrylic acid with at least an oleophilic unsaturated carboxylic acid, said emulsion polymer formed in the presence of anionic and nonionic surfactants to provide a polymer having a glass transition temperature of -15.degree. to -50.degree. C. A sufficient amount of chain transfer agent is employed to provide an emulsion polymer which when coated on a repulpable paper substrate enables recovery of paper fibers substantially free of adhesive under conditions of TAPPI Useful Method 213 and/or 204, and resistant to loss of adhesive properties on exposure to high humidity.
    Type: Grant
    Filed: April 14, 1994
    Date of Patent: July 16, 1996
    Assignee: Avery Dennison Corporation
    Inventors: William F. Scholz, Robert H. Van Ham, deceased, Louis C. Van Ham, legal representative, Richard P. Randall, legal representative