Abstract: The present disclosure generally relates to a system and a method for detecting a defect in a specimen. More particularly, the present disclosure relates to a lithography exposure system and a method for detecting a dispensing error in a wafer The present disclosure provides a system for detecting a defect in a specimen having a lithography exposure tool including a measurement unit and a stage, the measurement unit is configured to obtain topography data of the specimen placed on the stage by illumination of a surface of the specimen with an optical signal, and a processor configured to generate a statistical data from the topography data and produce a defect notification if the statistical data is outside of a control limit.

Abstract: An APC controller is configured to operate on a segregated data structure during its normal operation and to establish a control state during an initializing event for a non-initialized manufacturing context on the basis of other initialized or non-initialized manufacturing contexts. Thus, the processing of pilot substrates may be reduced or the processing of the pilot substrates may be initiated on the basis of reliably established process parameters.