Patents by Inventor Richard R. Doersch

Richard R. Doersch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielded via
    Patent number: 7781889
    Abstract: A system may include a first conductive ground pad, a second conductive ground pad, a first conductive via coupling the first ground pad to the second ground pad, a first conductive signal trace, a second conductive signal trace, and a second conductive via disposed within the first conductive via and coupling the first conductive signal trace to the second conductive signal trace. The first conductive ground pad and the second conductive ground pad may be disposed between the first conductive signal trace and the second conductive signal trace.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: August 24, 2010
    Assignee: Intel Corporation
    Inventors: Bram Leader, Richard R. Doersch
  • Shielded via
    Publication number: 20080001286
    Abstract: A system may include a first conductive ground pad, a second conductive ground pad, a first conductive via coupling the first ground pad to the second ground pad, a first conductive signal trace, a second conductive signal trace, and a second conductive via disposed within the first conductive via and coupling the first conductive signal trace to the second conductive signal trace. The first conductive ground pad and the second conductive ground pad may be disposed between the first conductive signal trace and the second conductive signal trace.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 3, 2008
    Inventors: Bram Leader, Richard R. Doersch