Patents by Inventor Richard R Endo
Richard R Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8973524Abstract: A spin deposition apparatus includes a deposition mask configured to be arranged proximate a target substrate. The deposition mask includes at least one fluid reservoir offset from a rotational axis of the deposition mask and configured to hold fluid for dispersal on a portion of a surface of the target substrate.Type: GrantFiled: November 27, 2012Date of Patent: March 10, 2015Assignee: Intermolecular, Inc.Inventors: Richard R. Endo, Rajesh Kelekar
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Publication number: 20140318450Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: ApplicationFiled: July 8, 2014Publication date: October 30, 2014Inventors: Richard R. Endo, Tony P. Chiang, James Tsung
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Patent number: 8815013Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: GrantFiled: February 7, 2007Date of Patent: August 26, 2014Assignee: Intermolecular, Inc.Inventors: Tony P Chiang, Richard R Endo, James Tsung
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Publication number: 20140166840Abstract: A substrate carrier is provided. The substrate carrier includes a base for supporting a substrate. A plurality of support tabs is affixed to a surface of the base. The plurality of support tabs have a cavity defined within an inner region of each support tab of the plurality of support tabs. A plurality of protrusions extends from the surface of the base, wherein one of the plurality of protrusions mates with one cavity to support one of the plurality of support tabs. A film is deposited over the surface of the base, surfaces of the plurality of support tabs and surfaces of the plurality of protrusions.Type: ApplicationFiled: December 14, 2012Publication date: June 19, 2014Applicant: INTERMOLECULAR, INC.Inventors: Wayne R. French, Kent Riley Child, Alonzo T. Collins, Jay B. Dedontney, Richard R. Endo, Aaron T. Francis, Zachary Fresco, Edward L. Haywood, Ashley David Lacey, Monica Sawkar Mathur, James Tsung, Danny Wang, Kenneth A. Williams, Maosheng Zhao
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Publication number: 20140147587Abstract: A spin deposition apparatus includes a deposition mask configured to be arranged proximate a target substrate. The deposition mask includes at least one fluid reservoir offset from a rotational axis of the deposition mask and configured to hold fluid for dispersal on a portion of a surface of the target substrate.Type: ApplicationFiled: November 27, 2012Publication date: May 29, 2014Applicant: INTERMOLECULAR, INC.Inventors: Richard R. Endo, Rajesh Kelekar
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Patent number: 8486844Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: GrantFiled: August 28, 2012Date of Patent: July 16, 2013Assignee: Intermolecular, Inc.Inventors: Richard R Endo, Tony P. Chiang, James Tsung
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Publication number: 20120322173Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: ApplicationFiled: August 28, 2012Publication date: December 20, 2012Applicant: Intermolecular, Inc.Inventors: Tony P. Chiang, Richard R. Endo, James Tsung
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Publication number: 20110065284Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: ApplicationFiled: November 24, 2010Publication date: March 17, 2011Inventors: Tony P. Chiang, Richard R. Endo, James Tsung
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Patent number: 7867904Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: GrantFiled: February 7, 2007Date of Patent: January 11, 2011Assignee: Intermolecular, Inc.Inventors: Tony P Chiang, Richard R Endo, James Tsung
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Publication number: 20080230092Abstract: A single-substrate cleaning apparatus and method of use are described. In an embodiment of the present invention, a liquid cleaning solution is dispensed in small volumes to form a substantially uniform static liquid layer over a substrate surface by atomizing the viscous liquid with an inert gas in a two-phase nozzle. In another embodiment of the present invention, after a layer of the cleaning solution is formed over the substrate to be cleaned, acoustic energy is applied to the substrate to improve the cleaning efficiency. In a further embodiment, cleaning solution precipitates are avoided by dispensing de-ionized water with a spray nozzle to gradually dilute the cleaning solution prior to dispensing de-ionized water with a stream nozzle.Type: ApplicationFiled: March 23, 2007Publication date: September 25, 2008Inventors: Alexander Sou-Kang Ko, Jianshe Tang, Brian J. Brown, Richard R. Endo, Steven Verhaverbeke, Cole Franklin, Dennis J. Yost, Runzi Chang
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Publication number: 20080020589Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: ApplicationFiled: February 7, 2007Publication date: January 24, 2008Inventors: Tony P. Chiang, Richard R. Endo, James Tsung
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Publication number: 20080017109Abstract: A system for processing a semiconductor substrate is provided. The system includes a mainframe having a plurality of modules attached thereto. The modules include processing modules, storage modules, and transport mechanisms. The processing modules may include combinatorial processing modules and conventional processing modules, such as surface preparation, thermal treatment, etch and deposition modules. In one embodiment, at least one of the modules stores multiple masks. The multiple masks enable in-situ variation of spatial location and geometry across a sequence of processes and/or multiple layers of a substrate to be processed in another one of the modules. A method for processing a substrate is also provided.Type: ApplicationFiled: February 7, 2007Publication date: January 24, 2008Inventors: Tony P. Chiang, Richard R. Endo, James Tsung