Patents by Inventor Richard R. Geveshausen

Richard R. Geveshausen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONNECTOR ASSEMBLY
    Publication number: 20110165795
    Abstract: A connector assembly can include a connector with a ground pin and a case. The case can have an electrically conductive surface. A capacitor is connected to the ground pin. The capacitor is also connected to the electrically conductive surface. The capacitor can be connected between the electrically conductive surface and the ground pin so that the electrically conductive surface and the ground pin are capacitively coupled.
    Type: Application
    Filed: March 16, 2011
    Publication date: July 7, 2011
    Inventors: Richard William Shaw, Richard R. Geveshausen
  • Connector assembly
    Patent number: 7963801
    Abstract: A connector assembly can include a connector with a ground pin and a case. The case can have an electrically conductive surface. A capacitor is connected to the ground pin. The capacitor is also connected to the electrically conductive surface. The capacitor can be connected between the electrically conductive surface and the ground pin so that the electrically conductive surface and the ground pin are capacitively coupled.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: June 21, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Richard William Shaw, Richard R. Geveshausen
  • Connector assembly
    Patent number: 7927147
    Abstract: A connector assembly can include a connector with a ground pin and a case. The case can have an electrically conductive surface. A capacitor is connected to the ground pin. The capacitor is also connected to the electrically conductive surface. The capacitor can be connected between the electrically conductive surface and the ground pin so that the electrically conductive surface and the ground pin are capacitively coupled.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: April 19, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Richard William Shaw, Richard R. Geveshausen