Abstract: An optical coupling system for coupling a light source to a photonic integrated circuit (PIC) comprises a multimode coupler configured to receive an input optical signal of a first mode. The multimode coupler triggers one or more higher-order modes from the input optical signal of the first mode. The optical coupling system also includes a mode de-multiplexer and an optical combiner. The mode de-multiplexer transfers the input optical signal of the first mode and one or more optical signals of the triggered one or more higher-order modes to respective output optical signals of the first mode. The optical combiner combines the respective output optical signals to produce a single output signal of the first mode.

Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed.

Abstract: A method of forming, on the surface of a glass material, a raised feature having a height within a target range, comprising (1) providing a glass material having a surface, (2) providing the glass material locally, at a location at or below the surface, with an amount of energy causing local expansion of the glass material so as to raise a feature on the surface at the location, (3) detecting the height of the raised feature or the height over time of the raised feature, (4) (a) if the height is below or approaching a value below the target range, providing the glass material at the location with energy in a greater amount, or (b) if the height is above or approaching a value above the target range, providing the glass material at the location with energy in a lesser amount, and (5) repeating steps (3) and (4) as needed to bring the height within the target range. Methods and devices for automating this process are also disclosed.

Abstract: Integrated silicon photonic active optical cable assemblies (ACOAs), as well as sub-assemblies and components for AOCAs, are disclosed. One component is a multifiber ferrule configured to support multiple optical fibers in a planar array. The multifiber ferrule is combined with a flat top to form a ferrule sub-assembly. Embodiments of a unitary fiber guide member that combines the features of the multifiber ferrule and the flat top is also disclosed. The ferrule sub-assembly or the fiber guide member is combined with a photonic light circuit (PLC) silicon substrate with transmitter and receiver units to form a PLC assembly. The PLC assembly is combined with a printed circuit board and an electrical connector to form an ACOA. An extendable cable assembly that utilizes at least one ACOA is also described.

Abstract: Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.

Abstract: A method and system for reducing arbitration latency employs speculative transmission (STX) without prior arbitration in combination with routing fabric scheduled arbitration. Packets are sent from source locations to a routing fabric through scheduled arbitration, and also through speculative arbitration, to non-contentiously allocate outputs that were not previously reserved in the routing fabric to the speculatively transmitted packets.

Abstract: Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.

Abstract: A method of forming, on the surface of a glass material, a raised feature having a height within a target range, comprising (1) providing a glass material having a surface, (2) providing the glass material locally, at a location at or below the surface, with an amount of energy causing local expansion of the glass material so as to raise a feature on the surface at the location, (3) detecting the height of the raised feature or the height over time of the raised feature, (4) (a) if the height is below or approaching a value below the target range, providing the glass material at the location with energy in a greater amount, or (b) if the height is above or approaching a value above the target range, providing the glass material at the location with energy in a lesser amount, and (5) repeating steps (3) and (4) as needed to bring the height within the target range. Methods and devices for automating this process are also disclosed.

Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed.

Abstract: Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

Abstract: Elevator system hall fixtures such as lanterns, hall call button switches and lights, gongs, and floor position indicators are connected to a controller via wireless transceivers. The controller can be a system, group, and/or car controller. A low power wireless system connects all fixtures on one hallway, with a higher power wireless system connecting each hallway with the appropriate controller.

Abstract: Air cleansing apparatus includes an electrostatic precipitator in which the collector plates are made of, for instance, reticulated chemical vapor deposited silicon carbide, or reticulated silicon carbide ceramic coated with titanium nitride, zirconium diboride, or chemical vapor deposited silicon carbide. Microorganisms entrained on the collector plates are thermally degraded or vaporized by microwave radiation directed against the plates during a sterilization period which follows a collection period.

Abstract: A machine having protruding elements 26 and an adjacent abradable seal 18, which move relative to each other, an air-path clearance G between the seal 18 and the elements 26 and an element distance D2 between the sensor 10 and the elements 26, is provided with a sensor 10 which is recessed within the seal 18 by a recess distance D. A clearance/thickness circuit 14 provides transmitted and reflected microwave signals 30,32 along a coaxial cable 12 having a characteristic impedance, to the sensor 10, which has an impedance substantially matched to the characteristic impedance of the cable 12. The sensor 10 provides the reflected signal 32 which is indicative of the recess distance D when the elements 26 are not in front of the sensor 10 and is indicative of the blade distance D2 between the sensor 10 and the elements 26 when the elements 26 are in front of the sensor 10.

Abstract: A capacitance pressure measuring circuit includes a pressure sensitive capacitive transducer and a reference capacitor that are configured in a differential mode to alternately charge and discharge in response to square wave signals. An integrator receives signals from the capacitors and outputs two voltage levels. These voltage levels are provided to a synchronous clock driven selectable sample and hold stage and then to a differential amplifier. The amplifier provides a linear voltage signal proportional to the change in the difference in capacitance of the transducer divided by the capacitance of the integrator.