Patents by Inventor Richard R. Hengst

Richard R. Hengst has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8017062
    Abstract: A semiconductor processing component includes a substrate and a layer overlying the substrate. The layer has a composition ReAyO1.5+2y, wherein Re is Y, La, a Lanthanoid series element, or a combination thereof, A is (Si1?aGea), 0.25?y?1.2, and 0?a?1.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: September 13, 2011
    Inventors: Yeshwanth Narendar, Matthew A. Simpson, Richard R. Hengst
  • Patent number: 7053411
    Abstract: A method for treating a semiconductor processing component, including: exposing the component to a halogen gas at an elevated temperature, oxidizing the component to form an oxide layer, and removing the oxide layer.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: May 30, 2006
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Andrew G. Haerle, Richard F. Buckley, Richard R. Hengst
  • Patent number: 6825123
    Abstract: A method for treating a semiconductor processing component, including: exposing the component to a halogen gas at an elevated temperature, oxidizing the component to form an oxide layer, and removing the oxide layer.
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: November 30, 2004
    Assignee: Saint-Goban Ceramics & Plastics, Inc.
    Inventors: Andrew G. Haerle, Richard F. Buckley, Richard R. Hengst
  • Publication number: 20040208815
    Abstract: A method for treating a semiconductor processing component, including: exposing the component to a halogen gas at an elevated temperature, oxidizing the component to form an oxide layer, and removing the oxide layer
    Type: Application
    Filed: April 21, 2004
    Publication date: October 21, 2004
    Applicant: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Andrew G. Haerle, Richard F. Buckley, Richard R. Hengst
  • Publication number: 20040209445
    Abstract: A method for treating a semiconductor processing component, including: exposing the component to a halogen gas at an elevated temperature, oxidizing the component to form an oxide layer, and removing the oxide layer
    Type: Application
    Filed: April 15, 2003
    Publication date: October 21, 2004
    Applicant: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: Andrew G. Haerle, Richard F. Buckley, Richard R. Hengst
  • Publication number: 20020130061
    Abstract: A wafer boat for supporting silicon wafers. The wafer boat includes a ceramic body having at least one wafer support structure sized to support a silicon wafer thereon. A ceramic coating is disposed on a surface of the wafer slot. The ceramic coating has an impurity migration preventing thickness and a wafer contact surface. The wafer contact surface has a post coating surface finish, which substantially prevents slip in the silicon wafers.
    Type: Application
    Filed: June 19, 2001
    Publication date: September 19, 2002
    Inventor: Richard R. Hengst
  • Patent number: 5931666
    Abstract: The invention relates to a vertical rack for semiconductor wafer processing having strictly horizontally disposed arms wherein each arms has a rounded tip.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: August 3, 1999
    Assignee: Saint-Gobain Industrial Ceramics, Inc.
    Inventor: Richard R. Hengst