Abstract: A technique for sealing a housing (10) is disclosed characterized by use of a multi-stage tool (50) specifically adapted to progressively cold roll and crimp seal one or more flanges (18) formed on a component (12) over a beaded edge (24) which, in one embodiment, may be formed on another component (14). The multi-stage tool (50) includes a series of laterally spaced roller dies (56A,56B,56C) configured to structurally support desired walls (15,16) of one or more of the components (12,14) during the process as well as progressively roll form and crimp the flanges (18) about the beaded edge (24) of the component (14).

Abstract: A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.

Abstract: A lightweight slot array antenna comprises an array of slotted waveguides and a radome. The radome consists of two or more sheets of fiberglass with a honeycombed dielectric disposed between and bonded to each pair of adjacent sheets. The array of slotted waveguides is disposed inside the radome. Honeycombed dielectric material may be disposed between and bonded to each pair of adjacent waveguides.

Abstract: A particular plastic material is formed into the desired component shape and then is plated by a process comprising; a particular surface preparation step, electroless deposition and electrolytic deposition which results in excellent plating adhesion. The plated component is then assembled with other components manufactured in the same manner or with compatible metal components such as aluminum and soldered together in a disclosed hot oil dip soldering process. In the soldering process, the plated plastic substrate is completely immersed in a hot oil medium at a temperature of approximately 243.degree. C. (470.degree. F.) for a time of approximately 60 seconds for solder reflow.