Abstract: A charge-coupled imaging device (FIG. 3) is thinned to allow for backside illumination. The device is further enhanced using ion implantation techniques to establish an electrical field (44) at the back surface, which functions to drive free electrons to potential wells generated beneath a gate structure (40) on the front surface. The device structure allows for both front side and backside illumination and is useful as a imaging device in applications where it is necessary to combine images from two different optical sources. The imaging device is particularly useful in terrestrial guidance systems (FIG. 5) where the imaging device is used to detect guide stars from a large guide star field. In such systems, the imaging device must be translated within an X-Y plane in order to cover the entire guide star field. In order to accurately know the position of the imaging device, optical fiducial marks are imaged onto a side of the imaging device opposite the side receiving the guide star photons.

Abstract: A support and positioning apparatus (10) for supporting and positioning a wafer (12), substrate or the like in a plasma assisted chemical etching process. Surround components (14, 16, 18, 20) positioned around the substrate (12) are comprised of substantially pure magnesium or are aluminum coated with a magnesium fluoride coating such that as a plasma tool associated with the plasma etching process traverses the edge of the substrate (12), the plasma etching environment generated from a fluorine containing feed gas emitted from the plasma tool does not significantly erode the surround components (14, 16, 18, 20) or cause contamination of the substrate (12).

Abstract: A laminated structure includes a wafer member with a membrane attached thereto, the membrane being formed of substantially hydrogen-free boron nitride having a nominal composition B.sub.3 N. The structure may be a component in a mechanical device for effecting a mechanical function, or the membrane may form a masking layer on the wafer. The structure includes a body formed of at least two wafer members laminated together with a cavity formed therebetween, with the boron nitride membrane extending into the cavity so as to provide the structural component such as a support for a heating element or a membrane in a gas valve. In another aspect borom is selectively diffused from the boron nitride into a <100> surface of a silicon wafer. The surface is then exposed to EDP etchant to which the diffusion layer is resistant, thereby forming a channel the wafer member with smooth walls for fluid flow.

Abstract: A standard thick silicon charge-coupled device (FIG. 1A) has its pixel face mounted to a transparent, optically flat glass substrate using a thin layer of thermoset epoxy. The backside silicon of the charge-coupled device is thinned to 10 .+-.0.5 um using a two-step chemi-mechanical process. The bulk silicon is thinned to 75 um with a 700 micro-grit aluminium oxide abrasive and is then thinned and polished to 10 um using 80 nm grit colloidal silica. Access from the backside to the aluminum bonding pads (36 of FIG. 5) of the device is achieved by photolithographic patterning and reactive ion etching of the silicon above the bonding pads. The charge-coupled device is then packaged and wire-bonded in a structure which offers support for the silicon membrane and allows for unobstructed backside illumination.

Abstract: A charge-coupled imaging device (FIG. 3) is thinned to allow for backside illumination. The device is further enhanced using ion implantation techniques to establish an electrical field (44) at the back surface, which functions to drive free electrons to potential wells generated beneath a gate structure (40) on the front surface. The device structure allows for both front side and backside illumination and is useful as an imaging device in applications where it is necessary to combine images from two different optical sources. The imaging device is particularly useful in terrestrial guidance systems (FIG. 5) where the imaging device is used to detect guide stars from a large guide star field. In such systems, the imaging device must be translated within an X-Y plane in order to cover the entire guide star field. In order to accurately know the position of the imaging device, optical fiducial marks are imaged onto a side of the imaging device opposite the side receiving the guide star photons.

Abstract: A laminated structure includes a wafer member with a membrane attached thereto, the membrane being formed of substantially hydrogen-free boron nitride having a nominal composition B.sub.3 N. The structure may be a component in a mechanical device for effecting a mechanical function, or the membrane may form a masking layer on the wafer. The structure includes a body formed of at least two wafer members laminated together with a cavity formed therebetween, with the boron nitride membrane extending into the cavity so as to provide the structural component such as a support for a heating element or a membrane in a gas valve. In another aspect borom is selectively diffused from the boron nitride into a <100> surface of a silicon wafer. The surface is then exposed to EDP etchant to which the diffusion layer is resistant, thereby forming a channel the wafer member with smooth walls for fluid flow.