Abstract: Systems and methods for performing operations based on acoustic locationing are described. An example device includes one or more microphones configured to sense sound waves propagating in an environment. The example device also includes one or more processors and one or more memories coupled to the one or more processors. The one or more memories store instructions that, when executed by the one or more processors, cause the device to recover sound wave information from the sensed sound waves, detect a presence of one or more persons in the environment based on the received sound wave information, determine an operation to be performed by one or more smart devices based on the detected presence of one or more persons, and instruct the one or more smart devices to perform the operation.

Abstract: Systems and methods for performing operations based on acoustic locationing are described. An example device includes one or more microphones configured to sense sound waves propagating in an environment. The example device also includes one or more processors and one or more memories coupled to the one or more processors. The one or more memories store instructions that, when executed by the one or more processors, cause the device to recover sound wave information from the sensed sound waves, detect a presence of one or more persons in the environment based on the received sound wave information, determine an operation to be performed by one or more smart devices based on the detected presence of one or more persons, and instruct the one or more smart devices to perform the operation.

Abstract: Methods and devices are described for operating an input device for an electronic system which includes a housing. The input device includes an input surface and a first substrate having a first plurality of sensor electrodes configured to sense input objects proximate the input surface, and a pair of force sensing electrodes on the bottom of the first substrate. The input device includes a second substrate having a planar spring plate including a perimeter region surrounding an interior region, the perimeter region including a leaf spring coupled to the housing, and a spacing layer configured to physically couple the interior region of the second substrate to the first substrate. A force applied to the input surface deflects the first substrate and the interior region relative to the perimeter region, changing a variable capacitance formed between the force sensing electrodes.

Abstract: Methods, systems and devices are described for operating an electronic system which includes a first plurality of sensor electrodes disposed in a first layer and configured to detect input objects at an input surface of the input device, the first plurality of sensor electrodes including a first subset of transmitter electrodes; a second plurality of sensor electrodes configured to detect a force imparted to the input surface and configured for capacitive coupling with the first subset of transmitter electrodes; and a compressible dielectric configured to compress in response to force applied to the input surface. The capacitive coupling between the transmitter electrodes and the second plurality of sensor electrodes is configured to vary in response to the applied force.

Abstract: An input device comprises a first plurality of sensor electrodes, a second plurality of sensor electrodes, and a processing system. The processing system comprises a first integrated circuit, a second integrated circuit, and a central controller. The first integrated circuit is coupled to the first plurality of sensor electrodes and configured to receive first resulting signals therewith. The second integrated circuit is coupled to the second plurality of sensor electrodes and configured to receive second resulting signals therewith. The central controller is communicatively coupled to the first and second integrated circuits. The central controller is configured to receive the first resulting signals from the first integrated circuit and the second resulting signals from the second integrated circuit and is configured to determine positional information from the first resulting signals and the second resulting signals and to communicate the positional information to a host processor.

Abstract: Methods, systems and devices are described for operating an electronic system which includes a pliable component having an input surface, a first array of sensor electrodes, a second array of sensor electrodes, and a third array of sensor electrodes. The input device also includes a conductive substrate spaced apart from the pliable component and a compliant component disposed between the pliable component and the conductive substrate. In response to pressure applied by an input object to the input surface, the pliable component and the first, second, and third arrays of sensor electrodes locally deform and the compliant component locally compresses such that a spacing between the conductive substrate and at least one electrode from each of the first, second, and third arrays decreases.

Abstract: Devices and methods are provided that facilitate improved input device performance. The devices and methods utilize a first electrode disposed on a first substrate, a second electrode coupled to a first side of a piezoelectric material and a third electrode coupled to a second side of the piezoelectric material. The second electrode and the third electrode are configured to facilitate actuation of the piezoelectric material, while the first electrode and the second electrode define at least part of a variable capacitance that facilitates force determination. A spacing element is coupled to the first substrate and defines a spacing between the first electrode and the second electrode. A transmission element is coupled to the third electrode and configured such that a force biasing the transmission element causes the second electrode to deflect relative to the first electrode, thus changing the variable capacitance.

Abstract: Methods and devices are described for operating an input device for an electronic system which includes a housing. The input device includes an input surface and a first substrate having a first plurality of sensor electrodes configured to sense input objects proximate the input surface, and a pair of force sensing electrodes on the bottom of the first substrate. The input device includes a second substrate having a planar spring plate including a perimeter region surrounding an interior region, the perimeter region including a leaf spring coupled to the housing, and a spacing layer configured to physically couple the interior region of the second substrate to the first substrate. A force applied to the input surface deflects the first substrate and the interior region relative to the perimeter region, changing a variable capacitance formed between the force sensing electrodes.

Abstract: Methods and devices are described for operating an input device for an electronic system which includes a housing. The input device includes an input surface and a first substrate having a first plurality of sensor electrodes configured to sense input objects proximate the input surface, and a pair of force sensing electrodes on the bottom of the first substrate. The input device includes a second substrate having a planar spring plate including a perimeter region surrounding an interior region, the perimeter region including a leaf spring coupled to the housing, and a spacing layer configured to physically couple the interior region of the second substrate to the first substrate. A force applied to the input surface deflects the first substrate and the interior region relative to the perimeter region, changing a variable capacitance formed between the force sensing electrodes.

Abstract: Devices and methods are provided that facilitate improved input device performance. Specifically, the devices and methods facilitate input using a pressure-sensitive layer whose electrical admittivity changes in response to pressure applied to a touch surface. An input device is provided that comprises a plurality of sensor electrodes including a set of primary sensor electrodes and a set of secondary sensor electrodes. Each primary sensor electrode is electrically coupled to at least one secondary sensor electrode to form a set of electrical admittances. In one embodiment, the pressure-sensitive layer is located between the sensor electrodes and the touch surface, such that changes in the admittivity of the pressure-sensitive layer in response to pressure on the touch surface cause corresponding changes in the admittances between the primary and secondary sensor electrodes.

Abstract: A processing system for a transcapacitive sensing device comprises a plurality of sensor electrodes sectioned by a seam, a first sensor electrode integrated circuit, and a second sensor electrode integrated circuit. The plurality of sensor electrodes comprises a plurality of transmitter electrodes intersecting a plurality of receiver electrodes. The first sensor electrode integrated circuit is communicatively coupled to a first subset of the plurality of sensor electrodes. The second sensor electrode integrated circuit is communicatively coupled to a second subset of the plurality of sensor electrodes. The first sensor electrode integrated circuit and the second sensor electrode integrated circuit are configured to operate the plurality of sensor electrodes in synchrony to transmit with the plurality of transmitter electrodes a set of transmitter signals and receive with the plurality of receiver electrodes a set of responses corresponding to the set of transmitter signals.

Abstract: Methods, systems and devices are described for operating an electronic system which includes a first plurality of sensor electrodes disposed in a first layer and configured to detect input objects at an input surface of the input device, the first plurality of sensor electrodes including a first subset of transmitter electrodes; a second plurality of sensor electrodes configured to detect a force imparted to the input surface and configured for capacitive coupling with the first subset of transmitter electrodes; and a compressible dielectric configured to compress in response to force applied to the input surface. The capacitive coupling between the transmitter electrodes and the second plurality of sensor electrodes is configured to vary in response to the applied force.

Abstract: Methods, systems and devices are described for operating an electronic system which includes a pliable component having an input surface, a first array of sensor electrodes, a second array of sensor electrodes, and a third array of sensor electrodes. The input device also includes a conductive substrate spaced apart from the pliable component and a compliant component disposed between the pliable component and the conductive substrate. In response to pressure applied by an input object to the input surface, the pliable component and the first, second, and third arrays of sensor electrodes locally deform and the compliant component locally compresses such that a spacing between the conductive substrate and at least one electrode from each of the first, second, and third arrays decreases.

Abstract: An input device comprises a first plurality of sensor electrodes, a second plurality of sensor electrodes, and a processing system. The processing system comprises a first integrated circuit, a second integrated circuit, and a central controller. The first integrated circuit is coupled to the first plurality of sensor electrodes and configured to receive first resulting signals therewith. The second integrated circuit is coupled to the second plurality of sensor electrodes and configured to receive second resulting signals therewith. The central controller is communicatively coupled to the first and second integrated circuits. The central controller is configured to receive the first resulting signals from the first integrated circuit and the second resulting signals from the second integrated circuit and is configured to determine positional information from the first resulting signals and the second resulting signals and to communicate the positional information to a host processor.

Abstract: Devices and methods are provided that utilize a first electrode disposed on a first substrate and a second electrode disposed on a second substrate, where the first electrode and the second electrode define at least part of a variable capacitance. A third substrate is arranged between the first substrate and the second substrate, the third substrate having an opening arranged such that at least a portion of the first electrode and the second electrode overlap the opening. A transmission element is provided that partially overlaps the opening. The transmission element is physically coupled to the second electrode such that a force biasing the transmission element causes the second electrode to deflect relative to the first electrode, thus changing the variable capacitance. A measurement of the variable capacitance may then be used to determine force information.

Abstract: Devices and methods are provided that facilitate improved input device performance. The devices and methods utilize a first substrate with proximity sensor electrodes and at least a first force sensor electrode disposed on the first substrate. A second substrate is physically coupled to the first substrate, where the second substrate comprises a spring feature and an electrode component. The electrode component at least partially overlaps the first force sensor electrode to define a variable capacitance between the first force sensor electrode and the electrode component. The spring feature is configured to facilitate deflection of the electrode component relative to the first force sensor electrode to change the variable capacitance. A measure of the variable capacitance may be calculated and used to determine force information regarding the force biasing the input device.

Abstract: A processing system for a transcapacitive sensing device comprises a plurality of sensor electrodes sectioned by a seam, a first sensor electrode integrated circuit, and a second sensor electrode integrated circuit. The plurality of sensor electrodes comprises a plurality of transmitter electrodes intersecting a plurality of receiver electrodes. The first sensor electrode integrated circuit is communicatively coupled to a first subset of the plurality of sensor electrodes. The second sensor electrode integrated circuit is communicatively coupled to a second subset of the plurality of sensor electrodes. The first sensor electrode integrated circuit and the second sensor electrode integrated circuit are configured to operate the plurality of sensor electrodes in synchrony to transmit with the plurality of transmitter electrodes a set of transmitter signals and receive with the plurality of receiver electrodes a set of responses corresponding to the set of transmitter signals.

Abstract: Input devices and methods are provided in which a sensing system is adapted to detect motion of an object on a surface and a processing system is coupled to the sensing system. The processing system is adapted to effect movement of a display pointer on a display in a first direction in response to motion of the object on the surface and effect continued movement of the display pointer in the first direction in response to the object being removed from the surface.

Abstract: A transcapacitive sensing device has and ohmic seam which sections a plurality of transmitter electrodes and also sections a plurality of receiver electrodes. A processing system is communicatively coupled with the transmitter electrodes and the receiver electrodes and configured to: transmit a first transmitter signal with a first transmitter electrode disposed on a first side of the ohmic seam; transmit a second transmitter signal with a second transmitter electrode disposed on a second side of the ohmic seam; receive a first response corresponding to said first transmitter signal with a first receiver electrode disposed on the first side of the ohmic seam; and receive a second response corresponding to said second transmitter signal with a second receiver electrode disposed on the second side of the ohmic seam.

Abstract: Methods and devices are described for operating an input device for an electronic system which includes a housing. The input device includes an input surface and a first substrate having a first plurality of sensor electrodes configured to sense input objects proximate the input surface, and a pair of force sensing electrodes on the bottom of the first substrate. The input device includes a second substrate having a planar spring plate including a perimeter region surrounding an interior region, the perimeter region including a leaf spring coupled to the housing, and a spacing layer configured to physically couple the interior region of the second substrate to the first substrate. A force applied to the input surface deflects the first substrate and the interior region relative to the perimeter region, changing a variable capacitance formed between the force sensing electrodes.