Abstract: A high precision automated wafer inspection station provides a base table area on which an X-Y stage is movable in mutually orthogonal directions relative to an inspection axis in alignment with a microscope or measuring instrument which is mounted on a bridge support above the table. The stage mechanism includes a wafer-supporting vacuum chuck having a top engagement surface for receiving and retaining the wafer, the chuck being rotatable about a central axis to provide angular positioning of the wafer, and focusable along the inspection axis. The wafer is moved on a dual probe mechanism in a horizontal plane from a first cassette controlled by an elevator at one side back to the first cassette, or to a second cassette controlled by an elevator at the opposite side of the table area.