Abstract: Methods, systems, and devices for wireless communications are described. In a wireless audio system, a first wireless device may generate a first media stream associated with a first media mode and a second media stream associated with a second media mode, buffer the first media stream in accordance with a first latency time value for adjusting a first latency time of the first media stream and buffering the second audio stream, independently from the first media stream, in accordance with a second latency time value for adjusting a second latency time of the second media stream, and transmit a mixed media stream including the buffered first media stream mixed with the buffered second media stream to a second wireless device.

Abstract: A heat and shock resistant integrated circuit (IC) of the present invention includes a base material, a metal layer disposed on the base material, a silicon die disposed on the metal layer, additive material disposed on the base material, gas filled filler material disposed between the additive material and the silicon die, and first traces electrically connecting the silicon die to the additive material. Packing of the integrated circuit provides exceptional thermal stress relief and impact protection of circuitry within the packaging.

Abstract: A heat and shock resistant integrated circuit (IC) of the present invention includes a base material, a metal layer disposed on the base material, a silicon die disposed on the metal layer, additive material disposed on the base material, gas filled filler material disposed between the additive material and the silicon die, and first traces electrically connecting the silicon die to the additive material. Packing of the integrated circuit provides exceptional thermal stress relief and impact protection of circuitry within the packaging.