Abstract: A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after des{acute over (m)}ear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.

Abstract: The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).