Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Methods of forming a sheet glass product comprising a plurality of growth-limited glass bump spacers. According to the methods, a glass pane of the sheet glass product is irradiated with laser radiation to locally heat the glass pane at a plurality of spacer localities and induce growth of a plurality of glass bump spacers in the glass pane. The growth of the plurality of glass bump spacers is limited by utilizing a growth-limiting plate comprising a scattering surface portion. The scattering surface portion of the growth-limiting plate mitigates damage to the growth-limiting plate and may also mitigate damage to the glass pane. Vacuum insulated glass products and systems for forming a growth-limited sheet glass product are also provided.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Abstract: Methods of forming a sheet glass product comprising a plurality of growth-limited glass bump spacers. According to the methods, a glass pane of the sheet glass product is irradiated with laser radiation to locally heat the glass pane at a plurality of spacer localities and induce growth of a plurality of glass bump spacers in the glass pane. The growth of the plurality of glass bump spacers is limited by utilizing a growth-limiting plate comprising a scattering surface portion. The scattering surface portion of the growth-limiting plate mitigates damage to the growth-limiting plate and may also mitigate damage to the glass pane. Vacuum insulated glass products and systems for forming a growth-limited sheet glass product are also provided.

Abstract: Methods of forming a sheet glass product comprising a plurality of growth-limited glass bump spacers. According to the methods, a glass pane of the sheet glass product is irradiated with laser radiation to locally heat the glass pane at a plurality of spacer localities and induce growth of a plurality of glass bump spacers in the glass pane. The growth of the plurality of glass bump spacers is limited by utilizing a growth-limiting plate comprising a scattering surface portion. The scattering surface portion of the growth-limiting plate mitigates damage to the growth-limiting plate and may also mitigate damage to the glass pane. Vacuum insulated glass products and systems for forming a growth-limited sheet glass product are also provided.

Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed.

Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed.

Abstract: Vacuum-insulated glass windows include two or more glass panes, and glass-bump spacers formed in a surface of one of the panes. The glass-bump spacers consist of the glass material from the body portion of the glass pane. At least one of the glass panes comprises chemically-strengthened glass. Methods of forming VIG windows include forming the glass-bump spacers by irradiating a glass pane with a focused beam from a laser. Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. In embodiments where the glass-bump spacers are formed in a chemically-strengthened glass pane, the glass-bump spacers may be formed before or after the chemical strengthening. A second glass pane is brought into contact with the glass-bump spacers, and the edges sealed. The resulting sealed interior region is evacuated to a pressure of less than one atmosphere.

Abstract: Vacuum-insulated glass windows include two or more glass panes, and glass-bump spacers formed in a surface of one of the panes. The glass-bump spacers consist of the glass material from the body portion of the glass pane. At least one of the glass panes comprises chemically-strengthened glass. Methods of forming VIG windows include forming the glass-bump spacers by irradiating a glass pane with a focused beam from a laser. Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. In embodiments where the glass-bump spacers are formed in a chemically-strengthened glass pane, the glass-bump spacers may be formed before or after the chemical strengthening. A second glass pane is brought into contact with the glass-bump spacers, and the edges sealed. The resulting sealed interior region is evacuated to a pressure of less than one atmosphere.

Abstract: Vacuum-insulated glass windows include two or more glass panes, and glass-bump spacers formed in a surface of one of the panes. The glass-bump spacers consist of the glass material from the body portion of the glass pane. At least one of the glass panes comprises chemically-strengthened glass. Methods of forming VIG windows include forming the glass-bump spacers by irradiating a glass pane with a focused beam from a laser. Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. In embodiments where the glass-bump spacers are formed in a chemically-strengthened glass pane, the glass-bump spacers may be formed before or after the chemical strengthening. A second glass pane is brought into contact with the glass-bump spacers, and the edges sealed. The resulting sealed interior region is evacuated to a pressure of less than one atmosphere.

Abstract: Raised features are formed on a transparent substrate having absorption of less than about 20% within a processing wavelength range. A portion of the substrate is irradiated with a light beam to increase the absorption of the irradiated portion of the substrate. Continued irradiation causes local heating and expansion of the substrate so as to form a raised feature on the substrate surface.

Abstract: A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.

Abstract: Methods of forming a sheet glass product comprising a plurality of growth-limited glass bump spacers. According to the methods, a glass pane of the sheet glass product is irradiated with laser radiation to locally heat the glass pane at a plurality of spacer localities and induce growth of a plurality of glass bump spacers in the glass pane. The growth of the plurality of glass bump spacers is limited by utilizing a growth-limiting plate comprising a scattering surface portion. The scattering surface portion of the growth-limiting plate mitigates damage to the growth-limiting plate and may also mitigate damage to the glass pane. Vacuum insulated glass products and systems for forming a growth-limited sheet glass product are also provided.

Abstract: Vacuum-insulated glass windows include two or more glass panes, and glass-bump spacers formed in a surface of one of the panes. The glass-bump spacers consist of the glass material from the body portion of the glass pane. At least one of the glass panes comprises chemically-strengthened glass. Methods of forming VIG windows include forming the glass-bump spacers by irradiating a glass pane with a focused beam from a laser. Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. In embodiments where the glass-bump spacers are formed in a chemically-strengthened glass pane, the glass-bump spacers may be formed before or after the chemical strengthening. A second glass pane is brought into contact with the glass-bump spacers, and the edges sealed. The resulting sealed interior region is evacuated to a pressure of less than one atmosphere.

Abstract: A modular active board subassembly for coupling a waveguide array to an electrical component on a printed wiring board may include a substrate board with a sidewall extending around at least a portion of an attachment surface of the substrate board and forming a component cavity on the attachment surface. A transceiver may be disposed in the component cavity proximate an inboard edge of the substrate board. The transceiver may be electrically coupled to conductors on the attachment surface and electrically coupled to electrical contacts on an upper surface of the sidewall. A waveguide may be positioned in the component cavity and extend from the outboard edge of the substrate to the transceiver. The waveguide may be coupled to the transceiver.

Abstract: The disclosure teaches methods of forming at least one bump in a glass substrate having a surface and a body portion. The method includes performing a first irradiation of a portion of the glass substrate to form in the glass surface the at least one bump having bump height. The method also includes performing thermal annealing of at least a portion of the glass substrate that includes the first irradiated portion. The method then includes performing a second irradiation of the bump to increase the bump height.

Abstract: A channeled substrate for forming integrated optical devices that employ optical fibers and at least one active optical component is disclosed. The channeled substrate includes a substrate member having an upper surface one or more grooves formed therein, and a transparent sheet. The transparent sheet, which is preferably made of thin glass, is fixed to the substrate member upper surface to define, in combination with the one or more grooves, one or more channels. The channels are each sized to accommodate an optical fiber to allow for optical communication through the transparent sheet between the active optical component and the optical fibers. Channeled substrates formed by molding and by drawing are also presented. Integrated optical devices that employ the channeled substrate are also disclosed.