Abstract: A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

Abstract: An optical detection and measurement system for selectively detecting the plane of the reflective surfaces of a workpiece. A laser source provides a low power, single wavelength collimated beam of light which is directed onto a workpiece. The beam is passed through a converging lens to a reflected focus on a quad detector. The light beams reflected from the workpiece pass through a diverging lens to the quad detector. The non-diverging optical axis center of the diverging lens is aligned with the center of the quad detector so that a reflected beam passing through the non-diverging optical axis center of the diverging lens creates equal photocurrent outputs from each of the four photosensitive elements of the quad detector to produce a null condition. Where the workpiece is made up of translucent or transparent layers which produce multiple reflected beams, reflected beams from surfaces other than the surface of interest are deflected away from the active surface of the quad detector by the diverging lens.

Abstract: A photolithography imaging system and method that performs the tasks of mask alignment, panel recognition, establishing position offsets and adjusting mask rotation for accurate overlay imaging of the mask onto the panel, and correctly adjusting image magnification or reduction to properly size each stepped image to the panel distortion. This invention applies more directly to substrate panels whose dimensional stability is found difficult to control, repeatedly. More specifically, it applies to panels whose X axis distortion factor varies greatly from its Y axis distortion factor and the average adjustment of the image magnification or reduction does not satisfy tight registration requirements. What is new is that the calculation of the magnification or reduction adjustment is based on the mask image dimensions.

Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

Abstract: A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.

Abstract: An optical detection and measurement system for selectively detecting the plane of the reflective surfaces of a workpiece. A laser source provides a low power, single wavelength collimated beam of light which is directed onto a workpiece. The beam is passed through a converging lens to a reflected focus on a quad detector. The light beams reflected from the workpiece pass through a diverging lens to the quad detector. The non-diverging optical axis center of the diverging lens is aligned with the center of the quad detector so that a reflected beam passing through the non-diverging optical axis center of the diverging lens creates equal photocurrent outputs from each of the four photosensitive elements of the quad detector to produce a null condition. Where the workpiece is made up of translucent or transparent layers which produce multiple reflected beams, reflected beams from surfaces other than the surface of interest are deflected away from the active surface of the quad detector by the diverging lens.

Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

Abstract: A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Abstract: A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.

Abstract: A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Abstract: A compact tension testing apparatus for determining the peel strength of a circuit line or film bonded to a substrate. A force gauge is mounted on an apparatus using low friction air bearings to allow the force gauge to self-align with the peeling location of the circuit line or film, thereby providing essentially orthogonal positioning relative to the substrate.

Abstract: A vacuum fixture incorporating a vacuum suctioning device which may be employed in the manufacture of thin film chip carriers through the intermediary of retaining parts which are to be processed on the surface of a suction plate in a dimensionally compensating operative mode. A process is disclosed which may be employed in the manufacture of thin film chip carriers which is adhered in a dimensionally compensating manner to the surface of an interposer plate which is supported on a suction plate of a vacuum fixture.

Abstract: A radially expandable device particularly adaptable for use as an endoprothesis is described along with a method of fabrication. The method begins by obtaining a number of individual, separate generally circular hoops by a number of ways, such as cutting a length of wire, forming it into a generally circular loop, and attaching the ends together. In another aspect of this method of fabrication, the individual, separate generally circular hoops are obtained by cutting the needed number from a tubing. Thereafter, a wave-like pattern is formed in each hoop, with a die, in a direction transverse the axis of the wire, creating a predetermined number of rings and attaching them at the crest point to form a stent that can be compressed for inserting into a lumen where it can be expanded to provided a needed support.

Abstract: The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.

Abstract: The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.

Abstract: A method for forming a tubular article having a perforated annular wall, such as a surgical stent, includes coating the exterior and interior cylindrical surfaces of a tubular member with a photoresist, exposing selected portions of the photoresist coated surfaces to light, developing the coating, and then etching the coating to remove unexposed portions of the coating and immediate underlying portions of the annular wall, thereby forming a tubular article having a wall structure defined by a skeletal framework. An apparatus for exposing a light-sensitive coating to a tubular article includes means for rotating and translating the article with respect to a light source, along a longitudinal axis and simultaneously exposing aligned portions of the interior and exterior cylindrical surfaces of the tubular member. The method and apparatus embodying the present invention are particularly suitable for forming stents that support the walls of weak human arteries.

Abstract: A radially expandable device particularly adaptable for use as an endoprothesis is described along with a method of fabrication. The method begins by obtaining a number of individual, separate generally circular hoops by a number of ways, such as cutting a length of wire, forming it into a generally circular loop, and attaching the ends together. In another aspect of this method of fabrication, the individual, separate generally circular hoops are obtained by cutting the needed number from a tubing. Thereafter, a wave-like pattern is formed in each hoop, with a die, in a direction transverse the axis of the wire, creating a predetermined number of rings and attaching them at the crest point to form a stent that can be compressed for inserting into a lumen where it can be expanded to provided a needed support.