Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: An optical subassembly (OSA) for an optoelectronic module uses an optical turn that permits mounting of the OSA on a circuit board of a primary module. A fabrication process for the OSA can achieve low complexity and high yield from the ability to fabricate the OSA separate from fabrication of the primary module. Fabrication of the OSA can include a burn-in test of an optoelectronic chip on a flex circuit that is small to reduce yield loss costs when the optoelectronic chip is defective. The OSA and the primary module can be mechanically attached and electrically connected using wire bonding techniques.

Abstract: A mechanical device is used for releasing and extracting a fiber optic module from a cage.

Abstract: A peripheral optical element efficiently collects light emitted by a light emitting diode (LED) to produce a high luminous intensity of emitted light within a limited viewing angle relative to an optical axis. An LED is positioned in the center of the peripheral optical element, the element comprising a base, a refractive and reflective surface, and an exiting surface. In one preferred embodiment of the present invention, the peripheral optical element is radially symmetric to form a ring element. In an alternative embodiment of the present invention an array of multiple peripheral optical elements is mounted in a frame to accommodate multiple LEDs, forming a light panel for power signaling applications.