Patents by Inventor Richard Russ

Richard Russ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nanomaterial-reinforced resins and related materials
    Patent number: 9120908
    Abstract: Provided are nanomaterial-reinforced resin compositions and related methods. The compositions include a reinforcing material, such as graphene, polyamic acid, carbon nanotubes, or dimethylacetamide that is dispersed into a resin. The reinforcing material is present in the resin at from about 0.001 to about 10 wt %. Also provided are methods of fabricating these compositions and methods of tailoring a composition to achieve a particular set of mechanical properties.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: September 1, 2015
    Assignee: UNIVERSITY OF HAWAII
    Inventors: Richard Russ, Mehrdad Ghasemi-Nejhad, Atul Tiwari, Anupama Chaturvedi, David A. Hummer, Vamshi Gudapati
  • NANOMATERIAL-REINFORCED RESINS AND RELATED MATERIALS
    Publication number: 20110245378
    Abstract: Provided are nanomaterial-reinforced resin compositions and related methods. The compositions include a reinforcing material, such as graphene, polyamic acid, carbon nanotubes, or dimethylacetamide that is dispersed into a resin. The reinforcing material is present in the resin at from about 0.001 to about 10 wt %. Also provided are methods of fabricating these compositions and methods of tailoring a composition to achieve a particular set of mechanical properties.
    Type: Application
    Filed: March 28, 2011
    Publication date: October 6, 2011
    Inventors: Richard Russ, Mehrdad Ghasemi-Nejhad, Atul Tiwari, Anupama Chaturvedi, David A. Hummer, Vamshi Gudapati
  • Complementary material conditioning system for a chemical mechanical polishing machine
    Patent number: 6022265
    Abstract: A complementary conditioning system for use in chemical mechanical polishing (CMP). The present invention functions with a CMP machine adapted for polishing a semiconductor wafer having tungsten components fabricated thereon. A polishing pad is mounted on the CMP machine. The polishing pad has a polishing surface configured for polishing the semiconductor wafer and its tungsten components. The performance of the polishing surface is characterized by a polishing efficiency. A complementary end-effector is mounted on the CMP machine. The complementary end-effector is adapted to chemically complement the tungsten components on the semiconductor wafer. The complementary end-effector is further adapted to contact the polishing surface and improve the polishing efficiency by chemically enhancing the polishing surface, thereby obtaining a more efficient removal rate for the chemical mechanical polishing.
    Type: Grant
    Filed: June 19, 1998
    Date of Patent: February 8, 2000
    Assignee: VLSI Technology, Inc.
    Inventors: Charles F. Drill, Calvin Gabriel, Milind Weling, Richard Russ, David E. Henderson