Abstract: A system can include a communication chain to operate in a communication band. The communication chain can be mounted on a circuit board. The system can include a connectivity device coupled to the communication chain. The system can include a metal shield. The metal shield can have a shield perimeter and the metal shield can be disposed over at least a portion of the communication chain. The metal shield can have at least one formation formed within the shield perimeter for providing a connection between the metal shield and the circuit board.

Abstract: A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.

Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.

Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The lead frame includes leads that have contact arms that are vertically offset from each other. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.

Abstract: Antennas and electronic devices using antennas are described herein. A mmWave antenna integrated module (AiM) may be disposed in a barrel hinge between the display and base portions of a laptop. An AiM module on the chassis of the laptop uses base station location and laptop location and orientation to rotate to provide mmWave communication. The chassis-mounted AiM module may be able to be magnetically attached and make electrical connection via pogo pins. A flexible printed circuit (FPC) and metal box may surround the AiM module to form an electromagnetic interference shield and thermal spreader. An identification system may be used to determine whether an antenna is compatible with a modem of the electronic device based on analog or digital signaling between the antenna side and modem side. An FPC may be disposed between portions of a bisected speaker box.

Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.

Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

Abstract: Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

Abstract: Disclosed are integration approaches for mm-wave planar phased array type architectures using multilayer substrate technologies. For instance, an apparatus may include a plurality of substrate layers, an integrated circuit, and a connector module. The plurality of substrate layers includes a first substrate layer having one or more phased array elements. The integrated circuit exchange one or more radio frequency (RF) signals (e.g., mm-wave signals) with the one or more phased array elements. The connector module exchange further signals with the integrated circuit that correspond to the one or more RF signals. For example, these further signals may be baseband or intermediate frequency (IF) signals.

Abstract: Certain embodiments relate to electronic devices and methods for forming electronic devices having a component shielded by a reworkable RF shield. The RF shield may be positioned to surround one or more components on a substrate. The RF shield may include a plurality of sidewalls and a top wall, the plurality of sidewalls including bumps extending outward therefrom. A portion of the top wall may be removed from the RF shield. The one or more components positioned under the top wall of the RF shield may be repaired or replaced if necessary. A lid may then be positioned over the removed portion of the top wall and placed so that the bumps engage apertures in the lid and result in the lid being rigidly coupled to the sidewalls. In one aspect of certain embodiments, a groove may be formed on one or more surfaces of the top wall. Other embodiments are described and claimed.

Abstract: An electronic package includes a printed circuit board having a primary side, and a secondary side. A component, having a main body, is attached to the primary side of the printed circuit board. A pad is attached to the main body of the component. The printed circuit board has an opening therein positioned near the pad.

Abstract: Certain embodiments relate to electronic devices and methods for forming electronic devices having a component shielded by a reworkable RF shield. The RF shield may be positioned to surround one or more components on a substrate. The RF shield may include a plurality of sidewalls and a top wall, the plurality of sidewalls including bumps extending outward therefrom. A portion of the top wall may be removed from the RF shield. The one or more components positioned under the top wall of the RF shield may be repaired or replaced if necessary. A lid may then be positioned over the removed portion of the top wall and placed so that the bumps engage apertures in the lid and result in the lid being rigidly coupled to the sidewalls. In one aspect of certain embodiments, a groove may be formed on one or more surfaces of the top wall. Other embodiments are described and claimed.

Abstract: A test device includes an element having a surface for contacting a first plane, and a probe having a free end positioned in a second plane. The element of the test having the surface to contact the first plane includes features for contacting a ground plane. The length of the probe in the test device is greater than the length of the element having a surface for contacting the first plane. An electronic package includes a printed circuit board having a primary side, and a secondary side. A component, having a main body, is attached to the primary side of the printed circuit board. A pad is attached to the main body of the component. The printed circuit board has an opening therein positioned near the pad. The probe passes through the opening in the printed circuit board to contact the pad from the secondary side of the printed circuit board.

Abstract: A test device includes an element having a surface for contacting a first plane, and a probe having a free end positioned in a second plane. The element of the test having the surface to contact the first plane includes features for contacting a ground plane. The length of the probe in the test device is greater than the length of the element having a surface for contacting the first plane. An electronic package includes a printed circuit board having a primary side, and a secondary side. A component, having a main body, is attached to the primary side of the printed circuit board. A pad is attached to the main body of the component. The printed circuit board has an opening therein positioned near the pad. The probe passes through the opening in the printed circuit board to contact the pad from the secondary side of the printed circuit board.