Abstract: A liquid cooled heat sink for electronic circuit boards is described. A heat sink base includes a liquid cooling arrangement to remove heat from the base. An arrangement of cooling fins extends from the base, and at least one surface of each fin includes a thermal interface layer. The arrangement is adapted so that the fins fit between parallel electronic circuit boards such that for each circuit board, a thermal contact layer of a fin contacts multiple components on the circuit board so as to conduct heat from the components into the fin, which in turn transfers heat to the heat sink base.

Abstract: A system and method of reducing back flow in an air mover having one or more blades is described. A flap is attached to a blade of the air mover such that, when back flow occurs, the flap obscures all or a portion of the space between blades during back flow.