Patents by Inventor Richard Schendelman

Richard Schendelman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interdigitated trans-die lead method of construction for maximizing population density of chip-on-board construction
    Patent number: 5075252
    Abstract: A novel implementation of a tape automated bonding process of attaching leads to a semiconductor die is disclosed which utilizes a method of attaching tape leads which extend across the interior surface of the die rather than radially outwardly from the die. Two-layer or three-layer tape construction is used, with the insulation being located between the top of the die and the leads. This technique enables lead placement on opposite sides of the die in interdigitated fashion, allowing die to be installed on a circuit board more closely adjacent than has previously been possible.
    Type: Grant
    Filed: May 14, 1990
    Date of Patent: December 24, 1991
    Inventor: Richard Schendelman