Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.

Abstract: A printhead has an aperture plate on a front side of the printhead, a diaphragm plate on a back side of the printhead, a body intermediate the aperture plate and the diaphragm plate, a chamber disposed within the body, a port boundary defining a port area, the port boundary disposed on the diaphragm plate and adjacent the chamber, a peripheral partially-etched region coinciding with a first portion of the port boundary, and a peripheral non-etched region coinciding with a second portion of the port boundary, wherein the port boundary is fractured at the partially etched peripheral portion and bent at the non-etched peripheral portion, the non-etched peripheral portion structured to prevent separation of the diaphragm plate and a leaflet defined by the partial-etched portion.

Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.

Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.

Abstract: A printhead assembly that includes a partially-etched port structured to be opened by application of pressure to the port area, one or more leaflets being depressed into an internal chamber communicating with the open port.

Abstract: A printhead assembly that includes a partially-etched port structured to be opened by application of pressure to the port area, one or more leaflets being depressed into an internal chamber communicating with the open port.

Abstract: A liquid drop ejector comprising a jet stack, thin film or thick film heaters formed on the surface of the jet stack, and at least one thin film or thick film temperature sensor operative to provide feedback temperature control for the thin film or thick film heater elements is provided. In one form, the liquid drop ejector also has the thin film or thick film heater elements grouped in segments that are operative to be individually controlled. In addition, in another form, the signal lines provided to the liquid drop ejector are patterned to allow for more uniform resistance over the span of the liquid drop ejector.

Abstract: Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.

Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.

Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.

Abstract: A printhead assembly that includes a partially-etched port structured to be opened by application of pressure to the port area, one or more leaflets being depressed into an internal chamber communicating with the open port.

Abstract: A drop emitting apparatus including a diaphragm layer disposed on a fluid channel layer, a roughened bonding region formed on a surface of the diaphragm layer, a thin film circuit having conformal raised contact regions disposed on the bonding region, and a plurality of electromechanical transducers adhesively attached to the raised contact regions and electrically connected to the conformal raised contact regions by asperity contacts formed between the conformal raised contact regions and the electromechanical transducers.

Abstract: A liquid drop ejector comprising a jet stack, thin film or thick film heaters formed on the surface of the jet stack, and at least one thin film or thick film temperature sensor operative to provide feedback temperature control for the thin film or thick film heater elements is provided. In one form, the liquid drop ejector also has the thin film or thick film heater elements grouped in segments that are operative to be individually controlled. In addition, in another form, the signal lines provided to the liquid drop ejector are patterned to allow for more uniform resistance over the span of the liquid drop ejector.

Abstract: A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings.

Abstract: A system and method of operation for a piezoelectric transducer is described which utilizes a mesa structure interposed between a piezoelectric material element and a chamber diaphragm. The system can be used as a sensor where a net motion to the diaphragm causes a net charge equal to the sum of the charges on each piezoelectric diaphragm. Alternatively, the system can be used as an actuator wherein an applied voltage causes movement of the piezoelectric transducer and the chamber diaphragm.

Abstract: A drop emitting apparatus including a diaphragm layer disposed on a fluid channel layer, a thin film circuit having raised contact regions disposed on the diaphragm layer, and a plurality of electromechanical transducers conductively attached to the raised contact regions.

Abstract: Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.