Patents by Inventor Richard Schmachtenberg, III
Richard Schmachtenberg, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8621750Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.Type: GrantFiled: November 23, 2009Date of Patent: January 7, 2014Assignee: Xerox CorporationInventors: Richard Schmachtenberg, III, John R. Andrews, Bradley J. Gerner, Jonathan R. Brick, Samuel Schultz, Chad J. Slenes
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Patent number: 8047634Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.Type: GrantFiled: June 5, 2009Date of Patent: November 1, 2011Assignee: Xerox CorporationInventors: Jonathan Robert Brick, Jim Stevenson, John Richard Andrews, Richard Schmachtenberg, III, Dan Leo Massopust, Sharon S. Berger, Terrance L. Stephens, Chad Johan Slenes
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Publication number: 20100065198Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.Type: ApplicationFiled: November 23, 2009Publication date: March 18, 2010Applicant: Xerox CorporationInventors: RICHARD SCHMACHTENBERG, III, JOHN R. ANDREWS, BRADLEY J. GERNER, JONATHAN R. BRICK, SAMUEL SCHULTZ, CHAD J. SLENES
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Patent number: 7645942Abstract: An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.Type: GrantFiled: December 9, 2005Date of Patent: January 12, 2010Assignee: Xerox CorporationInventors: Richard Schmachtenberg, III, John R. Andrews, Bradley J. Gerner, Jonathan R. Brick, Samuel Schultz, Chad J. Slenes
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Patent number: 7600863Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.Type: GrantFiled: January 4, 2006Date of Patent: October 13, 2009Assignee: Xerox CorporationInventors: Jonathan Robert Brick, Jim Stevenson, John Richard Andrews, Richard Schmachtenberg, III, Dan Leo Massopust, Sharon S. Berger, Terrance L. Stephens, Chad Johan Stenes
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Publication number: 20090244182Abstract: An inkjet external ink manifold is provided that allows for use of a jet stack that does not internally contain ink manifolds. The external ink manifold has a manifold body that includes one or more ink manifold chambers and includes ports arranged to connect the chambers to one or more ink reservoirs. The external ink manifold further includes an adhesive layer overlying and sealing the ink manifold chambers. The adhesive layer includes a plurality of ports arranged to connect the external ink manifold chambers to the jet stack.Type: ApplicationFiled: June 5, 2009Publication date: October 1, 2009Applicant: XEROX CORPORATIONInventors: Jonathan Robert Brick, Jim Stevenson, John Richard Andrews, Richard Schmachtenberg, III, Dan Leo Massopust, Sharon S. Berger, Terrance L. Stephens, Chad Johan Slenes
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Patent number: 7426952Abstract: Two circuit bearing substrates, such as a rigid electronic circuit board and a flexible circuit film, each having large arrays or multiple arrays of surface contact pads or traces, are mechanically and electrically joined without relocating the substrates during the bonding process by using a bonding apparatus with multiple working tools or bond shoes. The bonding apparatus includes a fixture for holding the circuit bearing substrates with a joining layer between them, and two or more independently operated heated bond shoes that compress different portions of the circuit bearing substrates with the joining layer, such as a layer of anisotropic conductive film.Type: GrantFiled: December 9, 2004Date of Patent: September 23, 2008Assignee: Xerox CorporationInventors: Bhalchandra M. Karandikar, Jonathan R. Brick, Richard Schmachtenberg, III
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Patent number: 7048361Abstract: A drop emitting apparatus including a diaphragm layer disposed on a fluid channel layer, a roughened bonding region formed on a surface of the diaphragm layer, a thin film circuit having conformal raised contact regions disposed on the bonding region, and a plurality of electromechanical transducers adhesively attached to the raised contact regions and electrically connected to the conformal raised contact regions by asperity contacts formed between the conformal raised contact regions and the electromechanical transducers.Type: GrantFiled: November 5, 2003Date of Patent: May 23, 2006Assignee: Xerox CorporationInventors: Richard Schmachtenberg, III, John R. Andrews, Cathie J. Burke, Peter J. Nystrom
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Patent number: 6998539Abstract: A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings.Type: GrantFiled: May 27, 2003Date of Patent: February 14, 2006Assignee: Xerox CorporationInventors: John R. Andrews, Bradley J. Gerner, Richard Schmachtenberg, III, Chad Slenes, Samuel V. Schultz
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Patent number: 6987348Abstract: A system and method of operation for a piezoelectric transducer is described which utilizes a mesa structure interposed between a piezoelectric material element and a chamber diaphragm. The system can be used as a sensor where a net motion to the diaphragm causes a net charge equal to the sum of the charges on each piezoelectric diaphragm. Alternatively, the system can be used as an actuator wherein an applied voltage causes movement of the piezoelectric transducer and the chamber diaphragm.Type: GrantFiled: September 16, 2003Date of Patent: January 17, 2006Assignee: Palo Alto Research Center Inc.Inventors: Steven A. Buhler, Karl A. Littau, John S. Fitch, John R. Andrews, Cathie J. Burke, Peter J. Nystrom, Richard Schmachtenberg, III
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Patent number: 6955419Abstract: A drop emitting apparatus including a diaphragm layer disposed on a fluid channel layer, a thin film circuit having raised contact regions disposed on the diaphragm layer, and a plurality of electromechanical transducers conductively attached to the raised contact regions.Type: GrantFiled: November 5, 2003Date of Patent: October 18, 2005Assignee: Xerox CorporationInventors: John R. Andrews, Cathie J. Burke, Peter J. Nystrom, Richard Schmachtenberg, III
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Patent number: 6116712Abstract: A method and apparatus for automatically compensating for thermal conditioning of an ink jet print head are provided. The method and apparatus monitor the time during which the print head experiences various temperatures. The driving voltage supplied to the ink jet transducer is adjusted over time to compensate for thermal conditioning of the print head.Type: GrantFiled: October 13, 1998Date of Patent: September 12, 2000Assignee: Xerox CorporationInventors: Christopher J. Laharty, Michele L. Fingerson, Richard Schmachtenberg, III
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Patent number: 5867189Abstract: The present invention provides an ink jet print head capable of fast, efficient and consistent printing. Such ink jet print heads include an ink ejecting component which incorporates electropolished surfaces. Electropolishing techniques useful in the production of such ink ejecting components are also discussed.Type: GrantFiled: October 31, 1996Date of Patent: February 2, 1999Assignee: Tektronix, Inc.Inventors: Maridana L. Whitlow, J. Kirk McGlothlan, Jeffrey J. Anderson, Randy C. Karambelas, Richard Schmachtenberg, III
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Patent number: 5574486Abstract: The present invention provides an ink jet print head capable of fast, efficient and consistent printing. Such ink jet print heads include an ink ejecting component which incorporates electropolished surfaces. Electropolishing techniques useful in the production of such ink ejecting components are also discussed.Type: GrantFiled: January 13, 1993Date of Patent: November 12, 1996Assignee: Tektronix, Inc.Inventors: Maridana L. Whitlow, J. Kirk McGlothlan, Jeffrey J. Anderson, Randy C. Karambelas, Richard Schmachtenberg, III
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Patent number: 4830620Abstract: An electrical connector comprises four conductor elements each having a surface portion which is spaced from, but presented towards, a first axis. The surface portions are equiangularly distributed about the first axis and are substantially equidistant from the first axis. Each conductor element extends at least partly between first and second planes which are perpendicular to the first axis. A rod structure has a central axis, the rod structure comprises four elongate bodies of conductive material which are supported in mutually electrically insulated relationship. The bodies of conductive material are substantially parallel to each other and substantially equiangularly distributed about the central axis of the rod structure and substantially equidistant therefrom.Type: GrantFiled: October 15, 1987Date of Patent: May 16, 1989Inventors: Daniel W. Marks, Richard Schmachtenberg, III
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Patent number: 4802873Abstract: A solid filler material is used to encapsulate active TFEL components supported by a substrate and disposed within a cavity. The cavity is created by affixing a rear cover plate to the substrate. The filler material is injected into the cavity as a liquid but cures to a solid under the influence of heat. This provides an effective moisture barrier and enhances the structural integrity of the panel rendering it immune to problems caused by changes in air pressure or caused by vibration.Type: GrantFiled: October 5, 1987Date of Patent: February 7, 1989Assignee: Planar Systems, Inc.Inventors: William A. Barrow, Richard Schmachtenberg, III
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Patent number: 4549783Abstract: An optical connector comprises first and second mating coupling members. The first member has two conductive terminal portions for connection to a driver circuit for a light emitting element, and the second member has a conductive portion which contacts the two terminal portions when the first and second members are coupled together for establishing electrical connection between the terminal portions.Type: GrantFiled: April 6, 1983Date of Patent: October 29, 1985Assignee: Tektronix, Inc.Inventor: Richard Schmachtenberg, III