Abstract: The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C4 to C20 ?-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C2 to C5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.

Abstract: The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C4 to C20 ?-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C2 to C5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.

Abstract: Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

Abstract: Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

Abstract: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.

Abstract: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.