Patents by Inventor Richard Seaver
Richard Seaver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11958293Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: June 3, 2021Date of Patent: April 16, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Patent number: 11807005Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: March 28, 2023Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Lam J. Choy
-
Patent number: 11806788Abstract: In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.Type: GrantFiled: November 26, 2018Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: David Champion, Pavan Suri, John Liebeskind, Richard Seaver
-
Patent number: 11712896Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: GrantFiled: April 4, 2022Date of Patent: August 1, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
-
Publication number: 20230234355Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-lam J. Choy
-
Publication number: 20230131184Abstract: Intermittent warming of a biologic sample including a nucleic acid includes receiving at a first end of a channel of a microfluidic device, a biologic sample including a nucleic acid, and warming a subset of a plurality of heating elements disposed adjacent to the channel. The method includes warming the heating elements to a particular temperature of a particular warming and cooling protocol. The method includes moving the biologic sample from the first end of the channel to a second end of the channel opposite the first end at a particular flow rate associated with the warming and cooling protocol, and intermittently warming the biologic sample using the subset of heating elements while the biologic sample moves from the first end of the channel to the second end of the channel.Type: ApplicationFiled: March 30, 2020Publication date: April 27, 2023Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Carson DENISON, Erik TORNIAINEN, Richard SEAVER
-
Patent number: 11612932Abstract: In an example implementation, a method of operating a sintering furnace includes receiving information about a green object load to be sintered in a sintering furnace, determining a sintering profile based on the information, and performing a sintering process according to the sintering profile. During the sintering process, a sensor reading that indicates a degree of densification of a green object in the load is accessed from a densification sensor. The method includes initiating a cool down phase of the sintering process if the sensor reading has reached a target sensor reading.Type: GrantFiled: November 26, 2018Date of Patent: March 28, 2023Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: David Champion, Richard Seaver, Pavan Suri
-
Publication number: 20220227131Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
-
Patent number: 11305537Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-Iam J Choy
-
Patent number: 11247470Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: February 15, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Publication number: 20210291520Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: June 3, 2021Publication date: September 23, 2021Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Publication number: 20210213525Abstract: In an example implementation, a sintering system includes a detection gas line to enable gas to flow into a sintering furnace from an external gas supply. The system includes a detection gas port inside the furnace through which gas from the detection gas line is to flow into the furnace, and a registration feature inside the furnace to enable positioning of a token green object proximate the gas detection port. The system includes a gas flow monitor to detect changes in gas flow through the detection gas line when the token green object shrinks during a sintering process in the furnace.Type: ApplicationFiled: November 26, 2018Publication date: July 15, 2021Inventors: David Champion, Pavan Suri, John Liebeskind, Richard Seaver
-
Patent number: 11034151Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: June 15, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Publication number: 20210121954Abstract: In an example implementation, a method of operating a sintering furnace includes receiving information about a green object load to be sintered in a sintering furnace, determining a sintering profile based on the information, and performing a sintering process according to the sintering profile. During the sintering process, a sensor reading that indicates a degree of densification of a green object in the load is accessed from a densification sensor. The method includes initiating a cool down phase of the sintering process if the sensor reading has reached a target sensor reading.Type: ApplicationFiled: November 26, 2018Publication date: April 29, 2021Inventors: David Champion, Richard Seaver, Pavan Suri
-
Publication number: 20200398563Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Publication number: 20200398562Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Publication number: 20200398564Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
-
Publication number: 20070063386Abstract: A mold tool includes one or more movable core members that push against molten material in the mold cavity during the packing stage of the molding process and thereby reduce the amount of time required for the packing stage of the molding process. The movable core member may be movably mounted in a cavity in a mold half, with nitrogen springs biasing the movable core member to generate a force on the molten material in the mold cavity.Type: ApplicationFiled: September 1, 2006Publication date: March 22, 2007Inventor: Richard Seaver
-
Publication number: 20060110489Abstract: A probe for plastic injection molds and the like measures the separation between mold parts due to pressurization of the molten plastic in the mold cavity. The probe may be connected to a system controller to halt the injection process if excessive separation is detected to thereby prevent damage to the molding apparatus. The mold set-up and/or design may be modified to prevent separation between the mold parts, thereby eliminating flash and potential damage to the molding apparatus. A computer may be coupled to the probe to store, process and display information from the probe concerning separation of the mold parts.Type: ApplicationFiled: November 18, 2005Publication date: May 25, 2006Inventor: Richard Seaver
-
Patent number: 6126276Abstract: A printhead used to eject fluid onto a recording medium has an integrated heat-sink which is used to cool the energy dissipation elements used to propel the fluid from the printhead. The printhead is comprised of a semiconductor substrate that has been processed with thin-film layers. On top of the thin-film layers is an orifice layer that has a pattern of orifices. Fluid feed channels, on the side of the printhead opposite the orifice, supply fluid to the pattern of orifices. Within the thin-film layers are energy dissipating elements which are used to transfer energy to the fluid thereby ejecting fluid from the orifice. The fluid is transferred to the orifice opening through fluid feed slots formed in the thin-film layer adjacent to the energy dissipation elements which is exposed in the fluid feed channel. An integrated heat-sink is attached to the energy dissipation elements to remove heat to the semiconductor substrate and the fluid supply in the fluid feed channel.Type: GrantFiled: March 2, 1998Date of Patent: October 3, 2000Assignee: Hewlett-Packard CompanyInventors: Colin C. Davis, Naoto Kawamura, Timothy Beerling, David R. Thomas, William R. Knight, David Waller, Richard Seaver