Patents by Inventor Richard Sewell Hamilton

Richard Sewell Hamilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9263601
    Abstract: Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: February 16, 2016
    Assignee: SunPower Corporation
    Inventors: Junbo Wu, Michael C. Johnson, Michael Cudzinovic, Joseph Behnke, Xi Zhu, David D. Smith, Richard Sewell Hamilton, Xiuwen Tu, Seung Bum Rim
  • Publication number: 20140174518
    Abstract: Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Inventors: Junbo Wu, Michael C. Johnson, Michael Cudzinovic, Joseph Behnke, Xi Zhu, David D. Smith, Richard Sewell Hamilton, Xiuwen Tu, Seung Bum Rim