Abstract: An integrated circuit device package includes a substrate, at least two integrated circuit dies mounted to the substrate, and a thermally conductive stiffener attached to the substrate to counteract warping of the substrate. The stiffener has a first portion in a thermally conductive relationship with a surface of a first integrated circuit die to provide a first heat dissipation mode for the first integrated circuit die, and has a second portion, different from the first portion, the second portion being configured to provide a second heat dissipation mode, different from the first heat dissipation mode, for a second integrated circuit die. The stiffener may be configured to expose a surface of the second integrated circuit die through an opening in the stiffener. A heat sink may be disposed in a thermally conductive relationship with the second integrated circuit die through the opening in the stiffener.

Abstract: A semiconductor device package includes a semiconductor die having two largest dimensions that define a major plane, a packaging material enclosing the semiconductor die, a plurality of contacts on a first exterior surface of the semiconductor device package that is parallel to the major plane, the first exterior surface defining a bottom of the semiconductor device package, and a pedestal of semiconductor material above the semiconductor die in a thermally-conductive, electrically non-conductive relationship with the semiconductor die. The semiconductor material of the pedestal may be doped to provide electromagnetic shielding of the semiconductor die.

Abstract: Embodiments relate to a die package featuring a sputtered metal shield to reduce Electro-Magnetic Interference (EMI). According to a particular embodiment, a die featuring a top surface exposed by surrounding Molded Underfill (MUF) material, is subjected to metal sputtering. The resulting sputtered metal shield is in direct physical and thermal contact with the die, and is in electrical contact with a substrate supporting the die (e.g., to provide shield grounding). Specific embodiments may be particularly suited to reducing the EMI of a package containing an electro-optic die, to between 3-15 dB. The conformal nature and small thickness of the sputtered metal shield desirably conserves space and reduces package footprint. Direct physical contact between the shield and the die surface exposed by the MUF, enhances thermal communication (e.g., reducing junction temperature). According to certain embodiments, the sputtered metal shield comprises a stainless steel liner, copper, and a stainless steel coating.

Abstract: A semiconductor device package includes a semiconductor die having two largest dimensions that define a major plane, a packaging material enclosing the semiconductor die, a plurality of contacts on a first exterior surface of the semiconductor device package that is parallel to the major plane, the first exterior surface defining a bottom of the semiconductor device package, and a pedestal of semiconductor material above the semiconductor die in a thermally-conductive, electrically non-conductive relationship with the semiconductor die. The semiconductor material of the pedestal may be doped to provide electromagnetic shielding of the semiconductor die.

Abstract: A semiconductor package includes spread inhibiting structure to constrain the movement of viscous material during fabrication. In some embodiments, the spread inhibiting structure comprises a recess in an underside of a package lid overlying the die. According to other embodiments, the spread inhibiting structure comprises polymer disposed on the lid underside proximate to a side of the packaged die. According to still other embodiments, the spread inhibiting structure comprises a polymer disposed around the top of the die to serve as a dam and contain spreading. In some embodiments, the viscous material may be a Thermal Integration Material (TIM) in an uncured state, and the polymer may be the TIM in a cured state.

Abstract: A system and method that enables merchants to settle credit card batches in real time. The system and method may be customized by individual merchants in a manner that allows merchants to be funded virtually instantaneously for credit card batches submitted via a real-time settlement process.

Abstract: A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a copper substrate and a native silicon oxide layer connected to the substrate by at least one intermediate layer. A method of providing a heat path through an integrated circuit package includes providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material.

Abstract: An integrated circuit package includes a substrate/interposer assembly having a plurality of conductive contacts and a plurality of conductive posts, such as copper posts, electrically coupled to at least some of the conductive contacts in the substrate/interposer assembly. The conductive posts are surrounded by a protective dielectric, such as a photoimageable dielectric (PID). An integrated circuit die may be disposed on the substrate/interposer assembly within an interior space surrounded by the dielectric. An additional integrated circuit die may be provided in a package-on-package (POP) configuration.

Abstract: An integrated circuit package includes a substrate/interposer assembly having a plurality of conductive contacts and a plurality of conductive posts, such as copper posts, electrically coupled to at least some of the conductive contacts in the substrate/interposer assembly. The conductive posts are surrounded by a protective dielectric, such as a photoimageable dielectric (PID). An integrated circuit die may be disposed on the substrate/interposer assembly within an interior space surrounded by the dielectric. An additional integrated circuit die may be provided in a package-on-package (POP) configuration.

Abstract: This invention relates to compositions which are capable of sequestering calcium ions and are derived in part from renewable carbohydrate feedstocks. The calcium sequestering compositions are mixtures containing one or more hydroxycarboxylic acid salts, one or more oxoacid anion salts, and one or more citric acid salts.

Abstract: This invention relates to compositions which are capable of sequestering calcium ions and are derived in part from renewable carbohydrate feedstocks. The calcium sequestering compositions are mixtures containing one or more hydroxycarboxylic acid salts, one or more oxoacid anion salts, and one or more citric acid salts.

Abstract: A lid comprising a heat conductive substrate and a native silicon oxide layer connected to said substrate by at least one intermediate layer; a lidded integrated circuit package; and a method of providing a heat path through an integrated circuit package comprising providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material.

Abstract: A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a copper substrate and a native silicon oxide layer connected to the substrate by at least one intermediate layer. A method of providing a heat path through an integrated circuit package includes providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material.

Abstract: A lid comprising a heat conductive substrate and a native silicon oxide layer connected to said substrate by at least one intermediate layer; a lidded integrated circuit package; and a method of providing a heat path through an integrated circuit package comprising providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material.

Abstract: This invention relates to compositions which are capable of sequestering calcium ions and are derived in part from renewable carbohydrate feedstocks. The calcium sequestering compositions are mixtures containing one or more hydroxycarboxylic acid salts and one or more aluminum salts.

Abstract: This invention relates to compositions which are capable of sequestering calcium ions and are derived in part from renewable carbohydrate feedstocks. The calcium sequestering compositions are mixtures containing one or more hydroxycarboxylic acid salts, one or more oxoacid anion salts, and one or more citric acid salts.