Abstract: The rectifier sub-assembly, formed by high temperature brazing, is glass encapsulated. It has axially extending leads with enlarged head portions. The sub-assembly is prepared for surface mounting by first flattening the leads outwardly from the enlarged head portions. An electrically insulating, heat conductive epoxy body is molded around the capsule, the enlarged head portions and at least a portion of each of the flattened lead sections. The leads are trimmed and if required, bent into the appropriate shape. After forming, the leads are barrel plated to obtain the best solderable surface for the most reliable electrical connection.

Abstract: A process for fabricating a multiplicity of semiconductor devices comprises the steps of applying electrodes to both faces of a semiconductor wafer, the mounting the semiconductor wafer to a substrate by means of an intervening layer of wax which bonds to the substrate and to the wafer. The wafer is then divided by grooves which extend through the wafer and at least partially through the layer of wax. The grooves are filled with a flexible resin that bonds to and passivates the edges of the chips, and the resin is subsequently cured. Next, the wax is removed from the cured resin and chips to provide a discrete flexible unit separate from the substrate. The discrete unit is divided into cells, each of which includes one of the chips for subsequent fabrication into a completed semiconductor device.