Abstract: A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Abstract: A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Abstract: A shielding arrangement for protecting a circuit containing magnetically sensitive materials from external stray magnetic fields. A shield of a material having a relatively high permeability is formed over the magnetically sensitive materials using thin film deposition techniques. Alternatively, a planar shield is affixed directly to a surface of semiconductor die containing an integrated circuit structure.

Abstract: A method and system for stacking integrated circuits is described. An integrated circuit stack is formed by stacking integrated circuit pairs. The integrated circuit pairs are formed by connecting an active surface of a first integrated circuit to an active surface of a second integrated circuit using flip chip bonding. The first integrated circuit pair is connected to a substrate using an adhesive. The other integrated circuit pairs are stacked sequentially on the first integrated circuit pair using an adhesive. Wire bonding is used to connect the second integrated circuit in each of the integrated circuit pairs to the substrate.

Abstract: A shielding arrangement for protecting a circuit containing magnetically sensitive materials from external stray magnetic fields. A shield of a material having a relatively high permeability is formed over the magnetically sensitive materials using thin film deposition techniques. Alternatively, a planar shield is affixed directly to a surface of semiconductor die containing an integrated circuit structure.

Abstract: A decoupling apparatus for a microcircuit provides for a custom capacitor to be placed directly on the passivated upper surface of the integrated circuit or alternatively to be placed directly under the integrated circuit.In another alternative, multiple standard chip capacitors are placed directly on the passivated upper surface and connected by wire bonds to metal bars also resting on the upper surface.