Patents by Inventor Richard Stanley Williams

Richard Stanley Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7445742
    Abstract: A method and mold for creating nanoscale patterns in an ion-selective polymer membrane is provided, in which a mold comprising a substrate and a molding layer having at least one protruding feature is imprinted on the ion-selective polymer membrane, thereby creating a recessed feature in the membrane. Protruding features having nanoscale dimensions can be created, e.g., by using self-assembled nanostructures as a shadow mask for etching a molding layer. In one embodiment, an imprinted ion selective polymer membrane, suitable for use as a solid electrolyte, is adapted for use in an electrochemical device or fuel cell by adding a metal catalyst to one portion of the membrane to serve as a catalytic electrode.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: November 4, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yong Chen, David Hacklernan, Laurie S. Mittelstadt, Yoocham Jeon, Richard Stanley Williams
  • Publication number: 20080020303
    Abstract: A contact lithography system includes a patterning tool having a pattern for transfer to a substrate; and at least one alignment device coupled to the patterning tool. The alignment device is configured to measure alignment between the patterning tool and a substrate for receiving the pattern of the patterning tool. A contact lithography method includes aligning a patterning tool having a pattern for transfer with a substrate for receiving the pattern of the patterning tool using at least one alignment device coupled to the patterning tool.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 24, 2008
    Inventors: Wei Wu, Shih-Yuan Wang, Richard Stanley Williams
  • Patent number: 7252862
    Abstract: A method for increasing adhesion between a substrate and a polymeric imprintable material during an imprinting procedure. The method includes chemically bonding a plurality of molecules to a surface of a substrate to form a self-assembled monolayer thereon. A monomer is copolymerized with the self-assembled monolayer to form a polymeric imprintable material that is chemically bonded to the self-assembled monolayer. Adhesion between the polymeric imprintable material and the substrate is substantially increased by the self-assembled monolayer.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: August 7, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gun Young Jung, Zhiyong Li, Richard Stanley Williams, Sivapackia Ganapathiappan
  • Patent number: 7191380
    Abstract: Methods for increasing defect tolerance and fault tolerance in systems containing interconnected components, in which a signal level is classified as belonging to one of a plurality of different, distinguishable classes based on one or more thresholds separating the signal-level classes, and defect-and-fault tolerant systems embodying the methods. An electronic-device embodiment including an array of nanowire crossbars, the nanoscale memory elements within the nanowire crossbars addressed through conventional microelectronic address lines, and a method embodiment for providing fault-tolerant interconnection interfaces with electrically distinguishable signal levels are described.
    Type: Grant
    Filed: September 10, 2003
    Date of Patent: March 13, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Philip J. Kuekes, Gadiel Seroussi, Richard Stanley Williams
  • Publication number: 20040110856
    Abstract: A method of forming features on substrates by imprinting is provided. The method comprises: (a) forming a polymer solution comprising at least one polymer dissolved in at least one polymerizable monomer; and (b) depositing the polymer solution on a substrate to form a liquid film thereon; and then either: (c) curing the liquid film by causing the monomer(s) to polymerize and optionally cross-linking the polymer(s) to thereby form a polymer film, the polymer film having a glass transition temperature (Tg); and imprinting the polymer film with a mold having a desired pattern to form a corresponding negative pattern in the polymer film, or (d) imprinting the liquid film with the mold and curing it to form the polymer film. The temperature of imprinting is as little as 10° C. above the Tg, or even less if the film is in the liquid state. The pressure of the imprinting can be within the range of 100 to 500 psi.
    Type: Application
    Filed: December 4, 2002
    Publication date: June 10, 2004
    Inventors: Jung Gun Young, Sivapackia Ganapathiappan, Yong Chen, Richard Stanley Williams