Patents by Inventor Richard Swartwout

Richard Swartwout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THIN-FILMS FOR CAPTURING HEAVY METAL
    Publication number: 20220135442
    Abstract: A heavy metal capture composition, devices including the composition, and a method of reducing heavy metal contamination in the environment is described.
    Type: Application
    Filed: February 22, 2020
    Publication date: May 5, 2022
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Moungi BAWENDI, Vladimir BULOVIC, Richard SWARTWOUT, Nicole MOODY
  • Lift-off embedded micro and nanostructures
    Patent number: 11152227
    Abstract: A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: October 19, 2021
    Assignee: Massachusetts Institute of Technology
    Inventors: Richard Swartwout, Farnaz Niroui, Vladimir Bulovic, Jeffrey H. Lang, Joel Jean
  • LIFT-OFF EMBEDDED MICRO AND NANOSTRUCTURES
    Publication number: 20190080932
    Abstract: A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.
    Type: Application
    Filed: August 21, 2018
    Publication date: March 14, 2019
    Applicant: Massachusetts Institute of Technology
    Inventors: Richard Swartwout, Farnaz Niroui, Vladimir Bulovic, Jeffrey H. Lang, Joel Jean