Patents by Inventor Richard T. Gill

Richard T. Gill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Germanium doped light emitting diode bonding process
    Patent number: 3986251
    Abstract: A method for bonding a gallium-type light emitting diode (LED) to a metallized substrate interconnection member, such as, a header, or a strip. An LED wafer is subjected to premetallizing backside processing in order to prepare the surface for a metallizing deposition step. During metallization, the backside wafer is deposited with a gold-germanium or gold-silicon alloy. Thereafter, the wafer is heated in forming gas in order to alloy the gold-germanium or gold-silicon first layer to the wafer backside. Then, a second layer of gold-germanium or gold-silicon is evaporated over the alloyed first layer. The LED chip or die is then eutectically die bonded to a metallized substrate.
    Type: Grant
    Filed: October 3, 1974
    Date of Patent: October 19, 1976
    Assignee: Motorola, Inc.
    Inventors: Raymond L. Altemus, Richard T. Gill