Abstract: Military systems in particular face two specific problems: field casualties typically increase as unit visibility decreases and it is often difficult for ground stations and/or headquarters to maintain control and visibility of geographically dispersed assets. The system provides satellite communications such as two-way messaging, Voice over Packet, and global positioning information and reporting for fixed and rotary wing aircrafts where traditional methods of communications are not otherwise practical. The system provides communications between remote users and other remote users as well as between remote users and control stations. In some embodiments there is an in-flight transceiver system that includes an antenna, an aviation box, and a switch. The aviation box conforms to a one-half, ½ short Air Transport Rack (ATR) form factor and includes a transceiver, an interface card, and a global positioning system (GPS) unit.

Abstract: A food timing system is disclosed that includes a number of timer modules associated with food holding devices in a restaurant. The timer modules are connected in a network for communicating information about the food being held in food holding compartments of the food holding devices. Each timer module includes a plurality of timers, with each timer being associated with a food holding compartment of a food holding device. The timers measure the holding time of food in each food holding compartment and are capable of transferring the holding time to another timer when the food is transferred to a holding compartment associated with the other timer.

Abstract: An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system (30) and a computer (32) connected to said silicon wafer image acquisition system (10), wherein said computer (32) automatically aligns a silicon wafer (16), calibrates the image acquisition system (30), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.

Abstract: A method and device for measurement and reduction of frequency offset in a communication network having a master reference terminal and at least one terminal exchanging reference and control bursts includes steps for adjusting demodulator frequency in the terminal responsive to a first frequency error between a first nominal frequency value and a respective reference burst received by the terminal, and adjusting modulator frequency at the terminal responsive to a second frequency error between a second nominal frequency value and a control burst generated by the master reference terminal and transmitted to the terminal.

Abstract: An apparatus and method for automatically detecting defects on silicon dies on silicon wafers comprising a silicon wafer acquisition system (30) and a computer (32) connected to said silicon wafer image acquisition system (10), wherein said computer (32) automatically aligns a silicon wafer (16), calibrates the image acquisition system (30), analyzes die images by determining a statistical die model from a plurality of dies, and compares the statistical die model to silicon die images to determine if the silicon dies have surface defects, is disclosed.

Abstract: An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.

Abstract: An apparatus and method for detecting defects on silicon dies on a silicon wafer (16) comprising an image acquisition system (10) and a computer (32) that determines a statistical die model by analyzing a random selection of dies (42) within a die matrix (37) and compares the statistical die model to matrices of silicon dies (38) to determine which silicon dies (38) have surface defects, is disclosed.