Patents by Inventor Richard Todd Miller

Richard Todd Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating element of a printhead having conductive layer between resistive layers
    Patent number: 6513913
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: February 4, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Donald W Schulte, Richard Todd Miller, Susanne L Kumpf
  • Fluid-jet printhead and mehod of fabricating a fluid-jet printhead
    Publication number: 20030001928
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Application
    Filed: August 21, 2002
    Publication date: January 2, 2003
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • HEATING ELEMENT OF A PRINTHEAD HAVING CONDUCTIVE LAYER BETWEEN RESISTIVE LAYERS
    Publication number: 20020158946
    Abstract: A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Application
    Filed: June 28, 2001
    Publication date: October 31, 2002
    Inventors: Donald W. Schulte, Richard Todd Miller, Susanne L. Kumpf
  • Heating element of a printhead having resistive layer over conductive layer
    Publication number: 20020158945
    Abstract: 10006488 A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • Fluid-jet printhead and method of fabricating a fluid-jet printhead
    Patent number: 6457815
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: October 1, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Richard Todd Miller, Susanne L. Kumpf
  • Fluid-jet printhead and method of fabricating a fluid-jet printhead
    Publication number: 20020101484
    Abstract: A fluid-jet printhead has a substrate on which at least one layer defining a fluid chamber for ejecting fluid is applied. The printhead includes an elevation layer disposed on the substrate and aligned with the fluid chamber. The printhead also includes a resistive layer disposed between the elevation layer and the substrate wherein the resistive layer has a smooth planer surface interfacing with the resistive layer.
    Type: Application
    Filed: January 29, 2001
    Publication date: August 1, 2002
    Inventors: Richard Todd Miller, Susanne L. Kumpf