Patents by Inventor Richard Toftness

Richard Toftness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Increasing Die Strength by Etching During or After Dicing
    Publication number: 20090191690
    Abstract: A semiconductor wafer having an active layer is mounted on a carrier with the active layer away from the carrier and at least partially diced on the carrier from a major surface of the semiconductor wafer. The at least partially diced semiconductor wafer is etched on the carrier from the said major surface with a spontaneous etchant to remove sufficient semiconductor material from a die produced from the at least partially diced semiconductor wafer to improve flexural bend strength of the die by removing at least some defects caused by dicing.
    Type: Application
    Filed: November 1, 2005
    Publication date: July 30, 2009
    Applicant: XSIL TECHNOLOGY LIMITED
    Inventors: Adrian Boyle, David Gillen, Kali Dunne, Eva Fernandez Gomez, Richard Toftness