Abstract: A constrained random test bench methodology employing an instruction abstraction layer. The instruction abstraction layer includes an instruction streamer for generating random test instruction sequences that preserve instruction order dependencies and randomly selecting data values from a valid range of data values. Multiple instruction streamers may be employed to simulate interrupt handlers and other functional design units sharing a control command bus. A priority scheduler sequences the instruction sequences generated by multiple instruction streamers based on a specified priority scheme.

Abstract: A constrained random test bench methodology employing an instruction abstraction layer. The instruction abstraction layer includes an instruction streamer for generating random test instruction sequences that preserve instruction order dependencies and randomly selecting data values from a valid range of data values. Multiple instruction streamers may be employed to simulate interrupt handlers and other functional design units sharing a control command bus. A priority scheduler sequences the instruction sequences generated by multiple instruction streamers based on a specified priority scheme.

Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Abstract: The present invention provides a simple high-throughput assay for detecting bcr/abl translocations. The method includes qualitative PCR methods for identifying the particular amplified translocation (e1a2 or b2a3/b3a2) and real time PCR for quantifying an amount of bcr/abl transcript (e1a2, b2a3 and b3a2). Quantitative measurement of bcr/abl transcript in accordance with the methods of the invention is useful for monitoring response to therapy.

Abstract: An electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped ear that is inserted through a clearance hole of the substrate and an attachment hole of the heat sink to attach the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package reduces the flatness requirements of the sink and the cost of producing the assembly.

Abstract: An electronic assembly which includes a heat sink. The assembly includes first and second integrated circuit packages that are mounted to a substrate. The heat sink may be in direct thermal contact with the first integrated circuit package and include a channel that is located adjacent to the second integrated circuit package. The channel allows air to flow across the second integrated circuit package and remove heat generated within the package.

Abstract: An electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped ear that is inserted through a clearance hole of the substrate and an attachment hole of the heat sink to attach the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package reduces the flatness requirements of the sink and the cost of producing the assembly.