Patents by Inventor Richard W. Decker

Richard W. Decker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit boards and method for manufacturing printed circuit boards
    Patent number: 4912020
    Abstract: A printed circuit board is described in which an electrically insulating laminate material (40) has first and second sides. An electrically conducting first circuit pattern (15) is embedded in the first side of the laminate material (40), and an electrically conducting second circuit pattern (20) is embedded in the second side of the laminate material (40) electrically insulated from the first circuit pattern (15) by the laminate material (40). A solid interconnection member (20) extends through the laminate material (40) and electrically contacts both the first and second circuit patterns (15,20) at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel (10) having a raised electrically conducting first circuit pattern (15) extending from a base layer (14) of conductive material and a raised electrically conducting second circuit pattern (20) extending from the first circuit pattern (15).
    Type: Grant
    Filed: September 2, 1988
    Date of Patent: March 27, 1990
    Assignee: Westinghouse Electric Corp.
    Inventors: David R. King, Mark S. Lee, Richard W. Decker
  • Printed circuit boards and method for manufacturing printed circuit boards
    Patent number: 4847446
    Abstract: A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material.
    Type: Grant
    Filed: June 2, 1988
    Date of Patent: July 11, 1989
    Assignee: Westinghouse Electric Corp.
    Inventors: David R. King, Mark S. Lee, Richard W. Decker
  • Printed circuit boards and method for manufacturing printed circuit boards
    Patent number: 4769309
    Abstract: A printed circuit board is described in which an electrically insulating laminate material has first and second sides. An electrically conducting first circuit pattern is embedded in the first side of the laminate material, and an electrically conducting second circuit pattern is embedded in the second side of the laminate material electrically insulated from the first circuit pattern by the laminate material. A solid interconnection member extends through the laminate material and electrically contacts both the first and second circuit patterns at selected locations thereof.The method for fabricating the board includes as a first step the fabrication of a first board panel having a raised electrically conducting first circuit pattern extending from a base layer of conductive material.
    Type: Grant
    Filed: October 21, 1986
    Date of Patent: September 6, 1988
    Assignee: Westinghouse Electric Corp.
    Inventors: David R. King, Mark S. Lee, Richard W. Decker