Abstract: A framework for a deployable antenna is disclosed herein. The framework basically includes a plurality of elongate ribs, a matching plurality of foldable resilient members, and a hub. Each of the elongate ribs has both a proximal end and a distal end. The foldable resilient members serve to interconnect the proximal ends of the elongate ribs to the hub. Within such a configuration, each of the foldable resilient members is capable of storing strain energy whenever forcibly folded and also releasing the strain energy whenever subsequently permitted to elastically unfold. Thus, whenever the elongate ribs are released from a stowed position in which the foldable resilient members are forcibly folded, the strain energy causes automatic deployment of the antenna as the foldable resilient members are permitted to elastically unfold. In sum, therefore, the framework obviates many conventional uses of electro-mechanical motors or actuators in deploying various antennas.

Abstract: A single surface reflector antenna and method for making same comprises a plurality of hat-shaped cross section ribs formed on the back surface of a reflector shell with flexible tooling. All antenna shell and backing structure components are comprised of triaxial weave graphite laminate layers thereby allowing the backing structure to conform precisely to the shape of the antenna shell when cured and heat cycled.

Abstract: A high density fiber optic cable including a cylindrical core member having a number of helical grooves extending along its length. Up to a hundred or more optical fibers are placed into each helical groove. The core member and fibers are covered by an outer member which retains the fibers and acts as an environmental seal. A strength member can be placed within an internal void in the core or the outer member can act as the strength member. Where the outer member is the strength member, additional cables may be placed within the internal void.

Abstract: One or more MIC's (microwave integrated circuits) are included in an assembly having a structurally continuous ground plane of conductive material for the microwave circuitry. Individual MIC's are mounted on a carrier and attached thereto by a layer of a dielectric adhesive. The adhesive is in contact with and interposed between the lower side of each MIC substrate and the carrier which may be, for example, a metal chassis. The carrier serves as, or includes, the structurally continuous ground plane of conductive material. Ground plane metallization on the lower side of MIC substrates is thereby made unnecessary. The dielectric adhesive may be maintained in a liquid or tacky state to permit convenient removal from the assembly of an MIC requiring rework or replacement. In addition, the layer of dielectric adhesive provides a thermally conductive path between an MIC and the carrier making the invention particularly well suited for MIC assemblies which are intended to be operated in a vacuum.

Abstract: The bottom surface of a substrate and the support surface of a base on which the substrate is to be mounted are treated with a release agent. A thin layer of a conformable resin is interposed between the treated surfaces of the substrate and base. Pressure is applied to cause the layer of resin to conform to irregularities in the two surfaces. This forms a heat transfer path between the substrate and base. It is particularly effective for heat transfer in a vacuum. Pressure on the conforming resin is maintained by rigid, releasable mechanical fasteners which hold the substrate to the base. Where good electrical conduction between the substrate and base is required in addition to good heat transfer, the resin is one of the electrically conductive types such as those filled with a powdered metal. Nondestructive removal of the substrate is accomplished by releasing the mechanical fasteners.

Abstract: One or more MIC's (microwave integrated circuits) are included in an assembly having a structurally continuous ground plane of conductive material for the microwave circuitry. Individual MIC's are mounted on a carrier and attached thereto by a layer of a dielectric adhesive. The adhesive is in contact with and interposed between the lower side of each MIC substrate and the carrier which may be, for example, a metal chassis. The carrier serves as, or includes, the structurally continuous ground plane of conductive material. Ground plane metallization on the lower side of MIC substrates is thereby made unnecessary. The dielectric adhesive may be maintained in a liquid or tacky state to permit convenient removal from the assembly of an MIC requiring rework or replacement. In addition, the layer of dielectric adhesive provides a thermally conductive path between an MIC and the carrier making the invention particularly well suited for MIC assemblies which are intended to be operated in a vacuum.