Abstract: A thermal liquid flow sensor and method of forming same. The sensor has a substrate and one or more sensing elements, disposed on the substrate, for sensing a property of a liquid. The liquid flow sensor, which can be for example a microsensor having a microbrick® structure, has a hydrophilic layer which is disposed on the substrate and covers the sensing element(s). The hydrophilic layer is preferably formed from a spin on glass material, such as for example a silicate or phosphosilicate. A silicon nitride layer can be disposed on the sensing element(s) and interpose the substrate and the hydrophilic layer. The silicon nitride layer can be oxidized, for example, by means of plasma oxidation or oxygen ion implantation so to form the hydrophilic layer thereon. A variety of other hydrophilic compounds can be utilized to form the hydrophilic layer such as, gold, palladium and diamond like carbon.

Abstract: A flow sensor system includes a plurality of flow sensor chips, wherein each flow sensor chip among the plurality of flow sensor chips comprises a substrate, a heater element, a heater control circuit, and flow sensor component formed on the substrate, wherein the heater element is disposed separately from the heater control circuit on the substrate, wherein the heater control circuit is thermally isolated from the heater element and the flow sensor component. Additionally, an air gap can be formed between each sensor chip among the plurality of flow sensor chips, wherein the plurality of flow sensor chips comprises a flow sensor system in which each of the flow sensor chips are separated from one another by the air gap formed therebetween in order to reduce output distortion, response time, warm-up time, drift and noise associated with the plurality of flow sensor chips.

Abstract: A thermal sensor includes a die having a surface formed to accept the outer surface of tubing; a molded plastic part located on the die surface, said molded plastic part including flexible portions having a surface adapted to engage the bottom half of the circumference of standard tubing when the tubing is fully placed in the molded plastic part; conductive material selectively patterned on the surface of the flexible portions that engages the die surface; and retaining hardware adapted to secure the tubing against the molded plastic part and flexible portions when the retaining hardware is secured to the molded plastic part.

Abstract: A modular sensor system includes a plurality of varying types of sensors that provide multiple sensing measurands for sensing operations. A housing is generally associated with the varying types of sensors, such that the housing introduces media to be sensed by the sensors. An electrical interface can also be connected to the sensors, wherein the electrical interface permits a logical physical connection to be made to a selected sensor in order to maximize sensing sensitivity and provide a sensing repeatability and accurate sensor compensation thereof for the sensing operations.

Abstract: A combined liquid flow tube alignment and liquid sensing system includes flow tube mounting and alignment hardware including a clip for fastening the hardware to a substrate; and a sensor for sensing integrated with the liquid flow tube mounting and alignment hardware, wherein fluid flowing through a flow tube mounted and aligned by the flow tube The flow tube mounting and alignment hardware includes a clip with internal periphery edges sized to match the external periphery edges of at least one sensing element associated with the sensor. At least two posts located at outer members of the clip above and below the tube. Posts are sized to be located ideally within a system to position and retain the outer diameter of liquid flow tube with respect to internal periphery edges of the clip and subsequently, the sensing element both horizontally and vertically. A center flexing member associated with the clip.

Abstract: Vapor sensing systems and methods are disclosed. An appliance such as a gas water heater, clothes dryer, and the like can be associated with a controller for controlling the appliance. A vapor sensor is also associated with the appliance, such that the vapor sensor comprises an active sensor and an error sensor, wherein the active sensor generates an active signal and the error sensor generates an error signal. An amplifier is also associated with the vapor sensor, such that the amplifier subtracts the error signal from the active signal to generate a compensated signal indicative of the presence of an ignitable vapor within a vicinity of the appliance and thereby instruct the controller to shut down the appliance.

Abstract: A method and apparatus for sensing a flammable vapor are described herein. Initially, a first thermal conductivity of a vapor at a first temperature and a second thermal conductivity of the vapor at a second temperature can be determined. Thereafter, a ratio of the first thermal conductivity signal to that of the second thermal conductivity can be calculated to obtain a primary “vapor” signal. The “vapor” ratio can then be compared to an “air” ratio of air without the vapor at the first temperature and the second temperature to obtain a secondary signal thereof. Such a secondary signal can then be compared to an alarm set-point value to thereby determine whether the vapor comprises a flammable vapor and a risk-reducing action thereof be taken.

Abstract: A vapor sensor is disclosed, which includes a substrate containing a sensing element, wherein the substrate is located proximate to a sleeve portion which covers and protects the sensing element. The vapor sensor also includes a vapor filter or permeable membrane affixed to an end of the sleeve portion, wherein the end of the sleeve portion is located opposite the sensing element. A housing and a cover are also provided, such that the housing retains the substrate and the cover snaps onto the housing. The housing itself includes walls from which a hole is formed through which vapors may pass. The vapor sensor can be mounted to a gas water heater in such a manner as to reduce air flow to the sensing element and prevent tampering of the vapor sensor unit itself.

Abstract: A sensor method and system are disclosed. A fluid flow sensor can be provided, which measures the thermal conductivity of a fluid. The sensor itself can be configured to comprise one or more sensing element associated with a sensor substrate. A heater can be associated with said sensor wherein said heater provides heat to said fluid. A film component can also be provided that that isolates said fluid from said heater and said sensor, such that said film component conducts heat in a direction from said heater to said sensor, thereby forming a thermal coupling between said sensor, said heater and said fluid, which permits said sensor to determine a composition of said fluid by measuring thermal conductivity thereof without undesired losses of heat in other directions. The film component can be configured on or in the shape of a tubing or a flow channel.

Abstract: A method and apparatus for sensing a flammable vapor are described herein. Initially, a first thermal conductivity of a vapor at a first temperature and a second thermal conductivity of the vapor at a second temperature can be determined. Thereafter, a ratio of the first thermal conductivity signal to that of the second thermal conductivity can be calculated to obtain a primary “vapor” signal. The “vapor” ratio can then be compared to an “air” ratio of air without the vapor at the first temperature and the second temperature to obtain a secondary signal thereof. Such a secondary signal can then be compared to an alarm set-point value to thereby determine whether the vapor comprises a flammable vapor and a risk-reducing action thereof be taken.

Abstract: An environmental sensor apparatus and method of making same is disclosed in which an environmentally sensitive silicon die is sandwiched between an elastomeric media seal and a conductive elastomeric pad contained within a housing. The conductive elastomeric pad contacts a printed circuit board (PCB) which leads from the housing. The die, elastomers and PCB are secured by a press fit plug which contacts the PCB and is heat staked to the housing to provide a substantially flush hermetic seal.