Abstract: A process for selective plating of a metal onto a substrate surface is provided. The process includes laminating a layer of conductive metal onto a dielectric substrate; and providing thru holes extending through said layer of conductive metal and said dielectric substrate.A thin layer of conductive metal is plated on the walls of the thru holes; and a photoresist layer is applied to the surface of the conductive metal and selectively exposed and developed to provide a mask corresponding to the negative of the desired circuit pattern.The exposed metal that is not covered by the photoresist is removed and then the remaining photoresist is removed to thereby provide the desired circuit pattern. A conductive metal is plated on the pattern up to the desired thickness.

Abstract: A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.