Patents by Inventor Richard W Seaver

Richard W Seaver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct imaging polymer fluid jet orifice
    Patent number: 6902259
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: June 7, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Colby Van Vooren, Colin C Davis, Richard W Seaver, Carl Wu, Jeffery S Hess
  • Apparatus and method for placing fluid droplets onto an object
    Publication number: 20040061746
    Abstract: An inkjet carriage for holding an inkjet pen includes an airflow reducing member configured and positioned to at least partially block airflow between an inkjet ejection nozzle of a pen on the carriage and an object to be printed upon during carriage movement.
    Type: Application
    Filed: September 30, 2003
    Publication date: April 1, 2004
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel J. Fredrickson, Richard W. Seaver
  • Apparatus and method for placing fluid droplets onto an object
    Patent number: 6669325
    Abstract: Disclosed herein is a method of placing fluid droplets onto an object. The method includes moving a fluid ejection device in a first direction, reducing air flow between the fluid ejection device and the object with a member leading the fluid ejection device, and ejecting the fluid droplets onto the object.
    Type: Grant
    Filed: May 8, 2002
    Date of Patent: December 30, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel J. Fredrickson, Richard W. Seaver
  • Fuel cell reactant supply
    Publication number: 20030228501
    Abstract: A fuel cell system in accordance with a present invention includes a fuel supply apparatus that supplies at least one reactant in a pulse.
    Type: Application
    Filed: June 10, 2002
    Publication date: December 11, 2003
    Inventors: David Champion, Philip A. Harding, Richard W. Seaver
  • Apparatus and method for placing fluid droplets onto an object
    Publication number: 20030210294
    Abstract: Disclosed herein is a method of placing fluid droplets onto an object. The method includes moving a fluid ejection device in a first direction, reducing air flow between the fluid ejection device and the object with a member leading the fluid ejection device, and ejecting the fluid droplets onto the object.
    Type: Application
    Filed: May 8, 2002
    Publication date: November 13, 2003
    Inventors: Daniel J. Fredrickson, Richard W. Seaver
  • Feature in firing chamber of fluid ejection device
    Publication number: 20030063163
    Abstract: A fluid ejection device has a firing chamber with a feature disposed therewithin.
    Type: Application
    Filed: September 12, 2002
    Publication date: April 3, 2003
    Inventors: Richard W. Seaver, Timothy L. Weber, James A. Mott, Dustin W. Blair, Charles C. Haluzak
  • Direct imaging polymer fluid jet orifice
    Patent number: 6520627
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: February 18, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis
  • Feature in firing chamber of fluid ejection device
    Patent number: 6502918
    Abstract: A fluid ejection device has a firing chamber with a feature disposed therewithin.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: January 7, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Richard W Seaver, Timothy L Weber, James A Mott, Dustin W Blair, Charles C Haluzak
  • Direct imaging polymer fluid jet orifice
    Publication number: 20020145644
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Application
    Filed: June 6, 2002
    Publication date: October 10, 2002
    Inventors: Chien-Hua Chen, Donald E. Wenzel, Qin Liu, Naoto Kawanura, Colby Van Vooren, Colin C. Davis, Richard W. Seaver, Carl Wu, Jeffery S. Hess
  • Direct imaging polymer fluid jet orifice
    Patent number: 6447102
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: September 10, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis
  • Direct imaging polymer fluid jet orifice
    Publication number: 20020071006
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Application
    Filed: February 1, 2002
    Publication date: June 13, 2002
    Inventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis
  • Direct imaging polymer fluid jet orifice
    Patent number: 6162589
    Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: December 19, 2000
    Assignee: Hewlett-Packard Company
    Inventors: Chien-Hau Chen, Donald E. Wenzel, Qin Liu, Naoto Kawamura, Richard W. Seaver, Carl Wu, Colby Van Vooren, Jeffery S. Hess, Colin C. Davis