Abstract: An ablation probe fixation apparatus for securing an ablation probe to tissue includes a base having a top surface and a skin-contacting bottom surface, wherein the base includes an adhesive layer disposed on the skin-contacting bottom surface. The fixation apparatus also includes a fixation member coupled to the top surface of the base. The base and the fixation member include an aperture defined therein for insertion of the ablation probe therethrough.

Abstract: An ablation probe fixation apparatus for securing an ablation probe to tissue includes a base having a top surface and a skin-contacting bottom surface, wherein the base includes an adhesive layer disposed on the skin-contacting bottom surface. The fixation apparatus also includes a fixation member coupled to the top surface of the base. The base and the fixation member include an aperture defined therein for insertion of the ablation probe therethrough.

Abstract: Disclosed is a spacer, configured to position microwave energy delivery devices, including a housing, with a housing body and a compression body, and at least one compression mechanism. The housing body forms a housing body cavity and a plurality of housing device apertures. The compression body forms a plurality of compression body apertures that each correspond to a housing device aperture. The compression body slideably engages the housing body cavity and at least a portion of the compression body is positioned within the compression body cavity. A compression mechanism is positioned between the housing body and the compression body and configured to provide a biasing force between the housing body and the compression body. In a first position the housing device apertures are misaligned with the compression body apertures and in the second position the housing apertures are aligned with the compression body apertures forming a plurality of aligned apertures.

Abstract: Disclosed is a spacer, configured to position microwave energy delivery devices, including a housing, with a housing body and a compression body, and at least one compression mechanism. The housing body forms a housing body cavity and a plurality of housing device apertures. The compression body forms a plurality of compression body apertures that each correspond to a housing device aperture. The compression body slideably engages the housing body cavity and at least a portion of the compression body is positioned within the compression body cavity. A compression mechanism is positioned between the housing body and the compression body and configured to provide a biasing force between the housing body and the compression body. In a first position the housing device apertures are misaligned with the compression body apertures and in the second position the housing apertures are aligned with the compression body apertures forming a plurality of aligned apertures.

Abstract: An ablation probe fixation apparatus for securing an ablation probe to tissue is disclosed. The ablation probe fixation apparatus includes a base having a top surface and a skin-contacting bottom surface, wherein the base includes an adhesive layer disposed on the skin-contacting bottom surface. The fixation apparatus also includes a fixation member coupled to the top surface of the base. The base and the fixation member include an aperture defined therein for insertion of the ablation probe therethrough.

Abstract: A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure (340) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads (341, 342) and an organic-based element (343) molded to the electrical leads. The semiconductor structure also includes a solder element (350) coupling together the electrical isolator structure and the substrate surface.

Abstract: A semiconductor structure (100) includes a substrate (110) having a first surface (111) with a mold lock feature (101). The semiconductor structure also includes a semiconductor chip (120) located over the first surface of the substrate. The semiconductor structure further includes an electrical isolator structure (340) located over the first surface of the substrate. The electrical isolator structure includes an electrical lead (341, 342) and an electrically insulative element (343) molded to the electrical lead. An optional portion (444) of the electrical isolator structure is located in the mold lock feature. The semiconductor structure additionally includes an adhesive element (450) located between and coupling the electrical isolator structure and the first surface of the substrate.