Abstract: A solution containing polymerizable monomers and volatile solvents can be used to disperse ceramic particles along with ceramic whiskers and remain pourable even with high solids. Using this dispersion, a high solids ceramic article can be molded, polymerized in situ and fired with a good binder burnout.

Abstract: Glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns are obtained by co-sintering a glass-ceramic composite and copper, silver, palladium, gold, based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems include composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process. The package is fabricated using a tape specifically designed for clean binder burnout in a reducing atmosphere at low temperatures and also for superior mechanical and thermal properties. Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.

Abstract: Colloidally stable dispersions of a spectral sensitizing dye are formed directly in water without the use of an organic solvent. The process of the invention involves mixing the dye particles with water to form a slurry and then homogenizing or milling the slurry at an elevated temperature in the presence of a surfactant to form finely divided particles uniformly dispersed in the water.