Abstract: Various embodiments described herein relate to apparatuses and methods associated with fluid pressure sensor systems and sealing members for the same. The sensing apparatus can include a sensor disposed on a substrate and an engagement member including a generally columnar sealing member configured to engage an inner cylindrical surface of a receiving tube within the housing connected to the substrate about the sensor. The sealing member can define an axial bore extending from a proximal end to a distal end, and one or more media can be disposed in the axial bore such that the sensor can detect a force applied to the media. The sealing member can include an outer sealing surface defining one or more engaging elements extending circumferentially about the sealing member, the one or more engaging elements configured to non-adhesively engage the inner cylindrical surface of the receiving tube to resist removal of the sensor assembly.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: Systems, apparatuses, and methods are disclosed for sensing a force applied by an external source. An example system comprises a substrate comprising a plurality of electrical contact pads disposed on a first surface of the substrate. The system further comprises a force sensing device disposed on a second surface of the substrate, the second surface opposite the first surface. The system further comprises a housing disposed on the second surface of the substrate. The housing defines an aperture that provides a common coupling interface. The common coupling interface provides a common path for the force to be transmitted to the force sensing device either through a first coupling or a second coupling different from the first coupling.

Abstract: A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor mounted on the PCB, a side wall engaging the PCB, a membrane, a cavity defined by the membrane, the side wall and the PCB, and a gel or liquid filling the cavity. The pressure sensor assembly may include a fill-hole extending into the cavity through which the cavity may be filled with the gel or liquid. The fill-hole may extend through one or both of the PCB and/or the side wall. The cavity is defined in part by a septum that allows a needle to pierce the septum for filling the cavity with the gel or liquid. A method of forming the pressure sensor assembly may include filling a cavity of the pressure sensor assembly with a gel or liquid through a fill-hole and curing the gel or liquid once in the cavity.

Abstract: A sense die comprises a chip comprising a sense diaphragm, one or more sense elements supported by the diaphragm, one or more bond pads supported by a first side of the chip, a structural frame disposed on the first side of the chip, and one or more electrical contacts extending through the structural frame. Each of the one or more bond pads is electrically coupled to at least one of the one or more sense elements. The structural frame is disposed at least partially about the diaphragm, and the one or more electrical contacts are electrically coupled to the one or more bond pads.

Abstract: Example systems, apparatuses and methods are disclosed for sensing a force applied by an external source. An example system comprises a substrate comprising a plurality of electrical contact pads disposed on a first surface of the substrate. The system further comprises a force sensing device disposed on a second surface of the substrate, the second surface opposite the first surface. The system further comprises a housing disposed on the second surface of the substrate. The housing defines an aperture that provides a common coupling interface. The common coupling interface provides a common path for the force to be transmitted to the force sensing device either through a first coupling or a second coupling different from the first coupling.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: Embodiments relate generally to a sensor device, method, and system are provided for housing a sensor. A pressure sensor assembly having a printed circuit board (PCB) with a pressure sensor and a ring mounted on the PCB. The pressure sensor assembly may include a force transmitting member positioned at least partially within the ring. The force transmitting member may transfer a force applied to a front side of the force transmitting member to a front side of the pressure sensor. A reservoir includes an extension that define an opening. The first side of the force transmitting member is exposed to the interior of the reservoir. The extension engages the first side of the force transmitting member to seal the opening.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: Embodiments relate generally to a sensor device, method, and system are provided for housing a sensor. An example force sensor includes an actuation element, a sense die, and a universal housing for holding a sense die. The universal housing has a top wall, a bottom wall, two side walls, and a back wall that define a cavity. The sense die is disposed within the cavity. The top wall defines an aperture having a first central axis therethrough. The housing defines an opening between the top wall and bottom wall extending from an exterior of the housing to the cavity. The opening has a second central axis and is configured to receive the sense die therethrough. At least a portion of the actuation element extends from the cavity through the aperture. The first central axis is orthogonal to the second central axis.

Abstract: A force sensor or sensor assembly may include a sense die, a housing, and a force transmitting member. The sense die may include a force sensing region and at least one bond pad. The housing may include a sense die receiving cavity, at least one electrical terminal configured to engage a bond pad of the sense die, a retention member configured to prevent the sense die from sliding out of the housing, and a hole in the housing that exposes the force sensing region of the sense die to the force transmitting element. The housing may include one or more component parts. In some cases, the force sensor or sensor assembly may be configured on a microscale through micro-manufacturing techniques.

Abstract: A system and method for operating a combustion system comprising a fuel nozzle defining at least one main fuel circuit and at least one pilot fuel circuit is generally provided. The method includes determining an overall flow of fuel, the overall flow of fuel defining a sum total fuel through the main fuel circuit and the pilot fuel circuit; determining a plurality of ranges of ratios of main fuel flow through the main fuel circuit versus pilot fuel flow through the pilot circuit from the overall flow of fuel, wherein each range of ratios is based on a combustion criterion different from one another; determining a resultant range of ratios of main fuel flow versus pilot fuel flow based on a hierarchy of combustion criteria, wherein the hierarchy of combustion criteria provides a priority ranking of the combustion criterion; and flowing the overall flow of fuel to the main fuel circuit and the pilot fuel circuit based on the resultant range of ratios of main fuel flow versus pilot fuel flow.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: A force sensor or sensor assembly may include a sense die, a housing, and a force transmitting member. The sense die may include a force sensing region and at least one bond pad. The housing may include a sense die receiving cavity, at least one electrical terminal configured to engage a bond pad of the sense die, a retention member configured to prevent the sense die from sliding out of the housing, and a hole in the housing that exposes the force sensing region of the sense die to the force transmitting element. The housing may include one or more component parts. In some cases, the force sensor or sensor assembly may be configured on a microscale through micro-manufacturing techniques.

Abstract: A force sensor includes a leadframe comprising a plurality of electrically conductive leads, a sense die coupled to the leadframe, and an encapsulant disposed over at least a portion of the leadframe and the sense die. The sense die is electrically coupled to the plurality of leads, and the plurality of leads extends from the encapsulant.

Abstract: The present disclosure is directed to a combustor assembly for a gas turbine engine. The combustor assembly includes an inner liner and an outer liner together defining a combustion chamber therebetween and a pressure plenum surrounding the inner liner and the outer liner. One or more of the inner liner and the outer liner defines one or more openings. The one or more liners includes a walled chute disposed at least partially within the opening. A structural member extends from the one or more liners to the walled chute.

Abstract: Apparatus and associated methods relate to a compact gas sensor (CGS) including a housing with a central stepped cavity with one or more first lead contact(s) forming a portion of a base plane in a bottom of the cavity and one or more second lead contact(s) forming a portion of a stepped plane higher than the base plane, the cavity sized to receive a chemically based stack of material made up of a bottom diffusion electrode layer, a middle electrolyte gel layer, and a top diffusion electrode layer. The bottom diffusion electrode layer is in electrical contact with the first lead contact(s). The top diffusion electrode layer electrically couples to the second lead contact(s) via an overlaying micro electromechanical system (MEMS) element layer with conductive coating. In an illustrative example, the CGS may provide gas sensing in small spaces.

Abstract: A force sensor may comprise a universal housing for holding a sense die. Typically, the universal housing may comprise a top wall, a bottom wall, two side walls, and a back wall. The housing may comprise an aperture located on the top wall to allow for interaction of an actuation element with an external force and the surface of the sense die. Additionally, the universal housing may comprise a cavity/opening to allow for the insertion of the sense die. Generally, the bottom wall of the housing may comprise one or more electrical connections for alignment with the bond pads on the sense die. The electrical connections may comprise electrical traces formed by laser selective plating and/or insert molded studs. Typically, the electrical connections may be formed after the universal housing is formed by injection molding to allow for customization based on a Customer's specific application.

Abstract: A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.

Abstract: A flip chip pressure sensor assembly. The flip chip pressure sensor assembly comprises a substrate; a pressure sensor die comprising a sensing diaphragm, the die having a top side and a bottom side that is reverse to the top side, where the top side of the die is electrically connected to the substrate by flip chip mounting technology; a cover defining an aperture disposed over the pressure sensor die, where the aperture defined by the cover aligns with the sensing diaphragm to provide a path for pressure to be transmitted through the aperture to the bottom side of the sensing diaphragm; and a gel disk disposed within the aperture in intimate contact with a bottom side of the sensing diaphragm, where the gel disk is domed above an outer shoulder of a rim defined by the cover.