Patents by Inventor Richard Wallingford
Richard Wallingford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10605744Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: January 8, 2018Date of Patent: March 31, 2020Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20190370955Abstract: Methods and systems for performing active learning for defect classifiers are provided. One system includes one or more computer subsystems configured for performing active learning for training a defect classifier. The active learning includes applying an acquisition function to data points for the specimen. The acquisition function selects one or more of the data points based on uncertainty estimations associated with the data points. The active learning also includes acquiring labels for the selected one or more data points and generating a set of labeled data that includes the selected one or more data points and the acquired labels. The computer subsystem(s) are also configured for training the defect classifier using the set of labeled data. The defect classifier is configured for classifying defects detected on the specimen using the images generated by the imaging subsystem.Type: ApplicationFiled: May 28, 2019Publication date: December 5, 2019Inventors: Jing Zhang, Yujie Dong, Brian Duffy, Richard Wallingford, Michael Daino, Kris Bhaskar
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Patent number: 10416087Abstract: An inspection system includes an illumination sub-system, a collection sub-system, and a controller. The illumination sub-system includes an illumination source configured to generate a beam of illumination and a set of illumination optics to direct the beam of illumination to a sample. The collection sub-system includes a set of collection optics to collect illumination emanating from the sample and a detector configured to receive the collected illumination from the sample. The controller is configured to acquire a test image of the sample, reconstruct the test image to enhance the resolution of the test image, and detect one or more defects on the sample based on the reconstructed test image.Type: GrantFiled: November 21, 2016Date of Patent: September 17, 2019Assignee: KLA-Tencor CorporationInventors: Jing Zhang, Jeremy Nesbitt, Grace Hsiu-Ling Chen, Richard Wallingford
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Patent number: 10402688Abstract: Systems and methods for providing an augmented input data to a convolutional neural network (CNN) are disclosed. Wafer images are received at a processor. The wafer image is divided into a plurality of references images each associated with a die in the wafer image. Test images are received. A plurality of difference images are created by differences the test images with the reference images. The reference images and difference images are assembled into the augmented input data for the CNN and provided to the CNN.Type: GrantFiled: September 29, 2017Date of Patent: September 3, 2019Assignee: KLA-Tencor CorporationInventors: Bjorn Brauer, Vijay Ramachandran, Richard Wallingford, Scott Allen Young
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Publication number: 20190108630Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: ApplicationFiled: November 30, 2018Publication date: April 11, 2019Inventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 10192303Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: GrantFiled: November 11, 2013Date of Patent: January 29, 2019Assignee: KLA Tencor CorporationInventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 10132760Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.Type: GrantFiled: July 6, 2017Date of Patent: November 20, 2018Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus B. Huber, Robert M. Danen
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Publication number: 20180202943Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: ApplicationFiled: January 8, 2018Publication date: July 19, 2018Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20180157933Abstract: Systems and methods for providing an augmented input data to a convolutional neural network (CNN) are disclosed. Wafer images are received at a processor. The wafer image is divided into a plurality of references images each associated with a die in the wafer image. Test images are received. A plurality of difference images are created by differences the test images with the reference images. The reference images and difference images are assembled into the augmented input data for the CNN and provided to the CNN.Type: ApplicationFiled: September 29, 2017Publication date: June 7, 2018Inventors: Bjorn Brauer, Vijay Ramachandran, Richard Wallingford, Scott Allen Young
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Patent number: 9880107Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: May 22, 2013Date of Patent: January 30, 2018Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20170307545Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image. In one aspect, determining an optimum one of the combinations of the first apertures includes selecting a set of one or more individual apertures that result in the highest signal to noise ratio for the defect area, and the method includes setting the optimum combination of the first apertures on the inspection tool and inspecting a sample using such optimum combination of the first apertures.Type: ApplicationFiled: July 6, 2017Publication date: October 26, 2017Applicant: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus B. Huber, Robert M. Danen
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Patent number: 9726617Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.Type: GrantFiled: November 8, 2013Date of Patent: August 8, 2017Assignee: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus B. Huber, Robert M. Danen
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Publication number: 20170191945Abstract: An inspection system includes an illumination sub-system, a collection sub-system, and a controller. The illumination sub-system includes an illumination source configured to generate a beam of illumination and a set of illumination optics to direct the beam of illumination to a sample. The a collection sub-system includes a set of collection optics to collect illumination emanating from the sample and a detector configured to receive the collected illumination from the sample. The controller is configured to acquire a test image of the sample, reconstruct the test image to enhance the resolution of the test image, and detect one or more defects on the sample based on the reconstructed test image.Type: ApplicationFiled: November 21, 2016Publication date: July 6, 2017Inventors: Jing Zhang, Jeremy Nesbitt, Grace Hsiu-Ling Chen, Richard Wallingford
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Publication number: 20140354983Abstract: Disclosed are methods and apparatus for optimizing a mode of an inspection tool. A first image or signal for each of a plurality of first apertures of the inspection tool is obtained, and each first image or signal pertains to a defect area. For each of a plurality of combinations of the first apertures and their first images or signals, a composite image or signal is obtained. Each composite image or signal is analyzed to determine an optimum one of the combinations of the first apertures based on a defect detection characteristic of each composite image.Type: ApplicationFiled: November 8, 2013Publication date: December 4, 2014Applicant: KLA-Tencor CorporationInventors: Pavel Kolchin, Richard Wallingford, Lisheng Gao, Grace H. Chen, Markus b. Huber, Robert M. Danen
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Patent number: 8775101Abstract: Methods and systems for detecting defects on a wafer are provided.Type: GrantFiled: August 2, 2011Date of Patent: July 8, 2014Assignee: KLA-Tencor Corp.Inventors: Junqing Huang, Yong Zhang, Stephanie Chen, Tao Luo, Lisheng Gao, Richard Wallingford
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Publication number: 20140153814Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.Type: ApplicationFiled: November 11, 2013Publication date: June 5, 2014Applicant: KLA-Tencor CorporationInventors: Jason Z. Lin, Allen Park, Ellis Chang, Richard Wallingford, Songnian Rong, Chetana Bhaskar
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Patent number: 8611639Abstract: Various methods, carrier media, and systems for monitoring a characteristic of a specimen are provided. One computer-implemented method for monitoring a characteristic of a specimen includes determining a property of individual pixels on the specimen using output generated by inspecting the specimen with an inspection system. The method also includes determining a characteristic of individual regions on the specimen using the properties of the individual pixels in the individual regions. The method further includes monitoring the characteristic of the specimen based on the characteristics of the individual regions.Type: GrantFiled: July 30, 2007Date of Patent: December 17, 2013Assignee: KLA-Tencor Technologies CorpInventors: Ashok Kulkarni, Chien-Huei (Adam) Chen, Cecelia Campochiaro, Richard Wallingford, Yong Zhang, Brian Duffy
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Publication number: 20130250287Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: ApplicationFiled: May 22, 2013Publication date: September 26, 2013Applicant: KLA-Tencor CorporationInventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Patent number: 8467047Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.Type: GrantFiled: July 3, 2012Date of Patent: June 18, 2013Assignee: KLA-Tencor Corp.Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
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Publication number: 20130035876Abstract: Methods and systems for detecting defects on a wafer are provided.Type: ApplicationFiled: August 2, 2011Publication date: February 7, 2013Applicant: KLA-TENCOR CORPORATIONInventors: Junqing Huang, Yong Zhang, Stephanie Chen, Tao Luo, Lisheng Gao, Richard Wallingford