Patents by Inventor Richard Warner
Richard Warner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11420391Abstract: A novel machine tool featuring a rotary tool changer is disclosed. In one embodiment, the tool changer is pre-tensioned, preferably by a counterweight, to improve repeatability when shifting from one tool to another. In another embodiment, the machine tool is principally a 3D printer, and features a novel cleaning mechanism that improves print quality, especially when printing elastomeric materials. In another embodiment, the machine tool features a rubbing tool that is heated and passed over the surface of a workpiece to improve the smoothness and precision of the workpiece.Type: GrantFiled: May 17, 2019Date of Patent: August 23, 2022Assignee: Diabase Prototyping and Engineering LLCInventors: Stephen Heston, Austin Reid, Richard Warner
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Publication number: 20190351617Abstract: A novel machine tool featuring a rotary tool changer is disclosed. In one embodiment, the tool changer is pre-tensioned, preferably by a counterweight, to improve repeatability when shifting from one tool to another. In another embodiment, the machine tool is principally a 3D printer, and features a novel cleaning mechanism that improves print quality, especially when printing elastomeric materials. In another embodiment, the machine tool features a rubbing tool that is heated and passed over the surface of a workpiece to improve the smoothness and precision of the workpiece.Type: ApplicationFiled: May 17, 2019Publication date: November 21, 2019Inventors: Stephen Heston, Austin Reid, Richard Warner
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Patent number: 9937723Abstract: A printhead assembly for an inkjet printer has a ink filter tower portion that contains filtered ink and includes multiple, substantially parallel extending elements. Settling of ink in an ink filter tower could clog the printhead nozzles and lessen the print quality. Therefore, in order to prevent the settling of the ink in the ink filter tower of the present design, a free-floating weighted slider is installed within the ink filter tower. The weighted slider has a top bridging member and downward-pointing shafts that are movable within trenches formed between the extending elements. During a reciprocating motion of the printhead assembly, the slider moves in a direction opposite to the direction of the printhead assembly and thereby agitates the ink within the tower. In addition to sliding from side to side of the printhead assembly, the slider may also be designed to pivot about an upper axis as it moves to further agitate the ink.Type: GrantFiled: January 13, 2017Date of Patent: April 10, 2018Assignee: Funai Electric Co., Ltd.Inventors: Sam Norasak, Shane McKinney, Richard Warner
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Publication number: 20170165974Abstract: A printhead assembly for an inkjet printer has a ink filter tower portion that contains filtered ink and includes multiple, substantially parallel extending elements. Settling of ink in an ink filter tower could clog the printhead nozzles and lessen the print quality. Therefore, in order to prevent the settling of the ink in the ink filter tower of the present design, a free-floating weighted slider is installed within the ink filter tower. The weighted slider has a top bridging member and downward-pointing shafts that are movable within trenches formed between the extending elements. During a reciprocating motion of the printhead assembly, the slider moves in a direction opposite to the direction of the printhead assembly and thereby agitates the ink within the tower. In addition to sliding from side to side of the printhead assembly, the slider may also be designed to pivot about an upper axis as it moves to further agitate the ink.Type: ApplicationFiled: January 13, 2017Publication date: June 15, 2017Inventors: Sam Norasak, Shane McKinney, Richard Warner
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Patent number: 9573379Abstract: A printhead assembly for an inkjet printer has a ink filter tower portion that contains filtered ink and includes multiple, substantially parallel extending elements. Settling of ink in an ink filter tower could clog the printhead nozzles and lessen the print quality. Therefore, in order to prevent the settling of the ink in the ink filter tower of the present design, a free-floating weighted slider is installed within the ink filter tower. The weighted slider has a top bridging member and downward-pointing shafts that are movable within trenches formed between the extending elements. During a reciprocating motion of the printhead assembly, the slider moves in a direction opposite to the direction of the printhead assembly and thereby agitates the ink within the tower. In addition to sliding from side to side of the printhead assembly, the slider may also be designed to pivot about an upper axis as it moves to further agitate the ink.Type: GrantFiled: March 22, 2016Date of Patent: February 21, 2017Assignee: Funai Electric Co., Ltd.Inventors: Sam Norasak, Shane McKinney, Richard Warner
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Publication number: 20160200102Abstract: A printhead assembly for an inkjet printer has a ink filter tower portion that contains filtered ink and includes multiple, substantially parallel extending elements. Settling of ink in an ink filter tower could clog the printhead nozzles and lessen the print quality. Therefore, in order to prevent the settling of the ink in the ink filter tower of the present design, a free-floating weighted slider is installed within the ink filter tower. The weighted slider has a top bridging member and downward-pointing shafts that are movable within trenches formed between the extending elements. During a reciprocating motion of the printhead assembly, the slider moves in a direction opposite to the direction of the printhead assembly and thereby agitates the ink within the tower. In addition to sliding from side to side of the printhead assembly, the slider may also be designed to pivot about an upper axis as it moves to further agitate the ink.Type: ApplicationFiled: March 22, 2016Publication date: July 14, 2016Inventors: Sam Norasak, Shane McKinney, Richard Warner
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Publication number: 20160107450Abstract: A printhead assembly for an inkjet printer has a ink filter tower portion that contains filtered ink and includes multiple, substantially parallel extending elements. Settling of ink in an ink filter tower could clog the printhead nozzles and lessen the print quality. Therefore, in order to prevent the settling of the ink in the ink filter tower of the present design, a free-floating weighted slider is installed within the ink filter tower. The weighted slider has a top bridging member and downward-pointing shafts that are movable within trenches formed between the extending elements. During a reciprocating motion of the printhead assembly, the slider moves in a direction opposite to the direction of the printhead assembly and thereby agitates the ink within the tower. In addition to sliding from side to side of the printhead assembly, the slider may also be designed to pivot about an upper axis as it moves to further agitate the ink.Type: ApplicationFiled: October 16, 2014Publication date: April 21, 2016Inventors: Sam NORASAK, Shane MCKINNEY, Richard WARNER
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Patent number: 9308737Abstract: A printhead assembly for an inkjet printer has a ink filter tower portion that contains filtered ink and includes multiple, substantially parallel extending elements. Settling of ink in an ink filter tower could clog the printhead nozzles and lessen the print quality. Therefore, in order to prevent the settling of the ink in the ink filter tower of the present design, a free-floating weighted slider is installed within the ink filter tower. The weighted slider has a top bridging member and downward-pointing shafts that are movable within trenches formed between the extending elements. During a reciprocating motion of the printhead assembly, the slider moves in a direction opposite to the direction of the printhead assembly and thereby agitates the ink within the tower. In addition to sliding from side to side of the printhead assembly, the slider may also be designed to pivot about an upper axis as it moves to further agitate the ink.Type: GrantFiled: October 16, 2014Date of Patent: April 12, 2016Assignee: FUNAI ELECTRIC CO., LTD.Inventors: Sam Norasak, Shane McKinney, Richard Warner
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Patent number: 9132654Abstract: A packaging label for an inkjet printhead including a first label portion adapted for adhesion to a first surface of the inkjet printhead, and a second label portion adapted for adhesion to a second surface of the inkjet printhead. The second label portion has a forked configuration including a first outer portion, a second outer portion and a central portion disposed between the first and second outer portions and adapted for adhesion to a packaging tape adhered to a nozzle plate of the inkjet printhead. The adhesion between the second label portion and the second surface of the inkjet printhead is higher than the adhesion between the first label portion and the first surface of the inkjet printhead.Type: GrantFiled: July 8, 2014Date of Patent: September 15, 2015Assignee: Funai Electric Co., Ltd.Inventors: Paul W. Dryer, Jason Vanderpool, Richard Warner, David Bernard, Andrew Lee McNees
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Publication number: 20070290700Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: July 27, 2007Publication date: December 20, 2007Inventors: Randy Schwindt, Warren Harwood, Paul Tervo, Kenneth Smith, Richard Warner
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Publication number: 20060113277Abstract: A method of micro-machining a semiconductor substrate to form through slots therein and substrates made by the method. The method includes providing a dry etching chamber having a platen for holding a semiconductor substrate. During an etching cycle of a dry etch process for the semiconductor substrate, a source power is decreased, a chamber pressure is decreased from a first pressure to a second pressure, and a platen power is increased from a first power to a second power. Through slots in the substrate provided by the method can have a reentrant profile for fluid flow therethrough.Type: ApplicationFiled: December 1, 2004Publication date: June 1, 2006Inventors: John Krawczyk, Andrew McNees, Richard Warner
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Publication number: 20060115921Abstract: Methods of micro-machining a semiconductor substrate to form through fluid feed slots therein. One method includes providing a semiconductor substrate wafer having a thickness greater than about 500 microns and having a device side and a back side opposite the device side. The back side of the wafer is mechanically ground to provide a wafer having a thickness ranging from about 100 up to about 500 microns. Dry etching is conducted on the wafer from a device side thereof to form a plurality of reentrant fluid feed slots in the wafer from the device side to the back side of the wafer.Type: ApplicationFiled: December 1, 2004Publication date: June 1, 2006Inventors: John Krawczyk, Andrew McNees, Richard Warner
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Publication number: 20060077221Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.Type: ApplicationFiled: November 17, 2005Publication date: April 13, 2006Inventors: Karthik Vaideeswaran, Andrew McNees, John Krawczyk, James Mrvos, Cory Hammond, Mark Doerre, Jason Vanderpool, Girish Patil, Christopher Money, Gary Williams, Richard Warner
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Publication number: 20060054591Abstract: A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.Type: ApplicationFiled: September 14, 2004Publication date: March 16, 2006Inventors: David Bernard, John Krawczyk, Christopher Money, Andrew McNees, Girish Patil, Karthik Vaideeswaran, Richard Warner
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Publication number: 20050194983Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: April 21, 2005Publication date: September 8, 2005Inventors: Randy Schwindt, Warren Harwood, Paul Tervo, Kenneth Smith, Richard Warner
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Publication number: 20050184744Abstract: A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times.Type: ApplicationFiled: February 11, 2005Publication date: August 25, 2005Inventors: Randy Schwindt, Warren Harwood, Paul Tervo, Kenneth Smith, Richard Warner
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Publication number: 20050093912Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.Type: ApplicationFiled: November 4, 2003Publication date: May 5, 2005Inventors: Karthik Vaideeswaran, Andrew McNees, John Krawczyk, James Mrvos, Cory Hammond, Mark Doerre, Jason Vanderpool, Girish Patil, Christopher Money, Gary Williams, Richard Warner
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Patent number: 4340326Abstract: A broken bit detector for use in conjunction with printed circuit board drilling machines or the like. The detector includes a light emitter and a light sensor contained within a pressure foot. The light emitter projects a beam of light through a central opening in the pressure foot and toward the light detector. Normally, the beam will be broken by a drill bit which passes through the opening. If a bit is not present, the light beam will not be broken and will be detected by the photosensor. Pressurized air is forced outward from both the light emitter and light detector in order to prevent any chips created by the drilling operation from striking the emitter or detector. The use of the air creates a shield which results in an accurate detector having a long life.Type: GrantFiled: February 25, 1980Date of Patent: July 20, 1982Assignee: Cooper Industries, Inc.Inventors: Andrew Buonauro, Richard Warner