Abstract: A semiconductor structure (100, 900) includes a substrate (110) having a surface (111) and also includes one or more semiconductor chips (120) located over the substrate surface. The semiconductor structure further includes an electrical isolator structure (340) located over the substrate surface, where the electrical isolator structure includes one or more electrical leads (341, 342) and an organic-based element (343) molded to the electrical leads. The semiconductor structure also includes a solder element (350) coupling together the electrical isolator structure and the substrate surface.

Abstract: A semiconductor structure (100) includes a substrate (110) having a first surface (111) with a mold lock feature (101). The semiconductor structure also includes a semiconductor chip (120) located over the first surface of the substrate. The semiconductor structure further includes an electrical isolator structure (340) located over the first surface of the substrate. The electrical isolator structure includes an electrical lead (341, 342) and an electrically insulative element (343) molded to the electrical lead. An optional portion (444) of the electrical isolator structure is located in the mold lock feature. The semiconductor structure additionally includes an adhesive element (450) located between and coupling the electrical isolator structure and the first surface of the substrate.