Abstract: A portable communication device includes a transducer enclosed in an enclosure. An opening allows flow of air between the transducer enclosed in the enclosure and a surrounding environment. The enclosure protects the transducer from misreading due to occlusion of environmental aggressors on the transducer. The enclosure is configured to repel the environmental aggressors away from a surface of the transducer and to keep a portion of the opening unclogged to maintain an air flow to the transducer.

Abstract: A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.

Abstract: A miniature gas sensing device includes a silicon-based substrate embedded with one or more heating elements. One or more electrodes are disposed on the substrate, and a semiconductor gas sensing layer is deposited over the substrate including over the one or more electrodes. The semiconductor gas sensing layer includes sensing grains forming a porous matrix, and a nanometer-scale barrier oxide layer deposited over the sensing grains. The barrier layer separates gas adsorption from surfaces of the sensing grains, and enables electron tunneling based charge transfer process from the sensing grains to the barrier oxide layer. The barrier oxide layer enhances the sensor stability and promotes signal selectivity by favoring detection of strongly oxidizing and/or reducing gas species over less reactive gas species.

Abstract: An environmental sensor may include a heat source that heats a metal oxide sensing material. Electrodes may be formed in the metal oxide sensing material that measure the resistance of the metal oxide sensing material to determine the concentration of various gases. The environmental sensor may include an infrared light source that emits infrared light at a given wavelength. An infrared detector and band-pass filter may be used to detect the concentration of a particular gas such as carbon dioxide. In order to reduce power consumption, a heater may act as both the heat source for the metal oxide sensing material and the infrared light source for the infrared detector. The metal oxide sensing material, heater, and infrared detector may be formed in the same enclosure. The enclosure may have an opening that is aligned with an opening in an electronic device housing.

Abstract: An environmental sensor may include a heat source that heats a metal oxide sensing material. Electrodes may be formed in the metal oxide sensing material that measure the resistance of the metal oxide sensing material to determine the concentration of various gases. The environmental sensor may include an infrared light source that emits infrared light at a given wavelength. An infrared detector and band-pass filter may be used to detect the concentration of a particular gas such as carbon dioxide. In order to reduce power consumption, a heater may act as both the heat source for the metal oxide sensing material and the infrared light source for the infrared detector. The metal oxide sensing material, heater, and infrared detector may be formed in the same enclosure. The enclosure may have an opening that is aligned with an opening in an electronic device housing.

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: An embodiment of an article of luggage is disclosed, the luggage in one practice having compression and expansion capability comprising an interposed metal frame of split configuration having an expansion portion positioned between the split where the metal frame is attached to one side of the luggage. One of more expansion and locking devices permit compression of contents and also enables locking the luggage in its expanded shape.

Abstract: An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: An embodiment of an article of luggage is disclosed, the luggage in one practice having compression and expansion capability comprising an interposed metal frame of split configuration having an expansion portion positioned between the split where the metal frame is attached to one side of the luggage. One of more expansion and locking devices permit compression of contents and also enables locking the luggage in its expanded shape.

Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract: This disclosure provides systems, methods and apparatus relating to electromechanical display devices. In one aspect, a multi-stage interferometric modulator (IMOD) can include a movable reflector that can be moved to different positions to produce different reflected colors. The IMOD can include deformable elements that are coupled to a back side of the movable reflector and provide support to the movable reflector. The deformable elements can provide a restoring force that biases the movable reflector to a resting position. The IMOD can include one or more restoring force modifiers that are configured to increase the restoring force when engaged. The restoring force modifiers can be between the movable reflector and the deformable elements such that the deformable elements contact the restoring force modifiers when the movable reflector is displaced to a contacting position.

Abstract: An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.

Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

Abstract: This disclosure provides systems, methods and apparatus relating to electromechanical display devices. In one aspect, a multi-stage interferometric modulator (IMOD) can include a movable reflector that can be moved to different positions to produce different reflected colors. The IMOD can include deformable elements that are coupled to a back side of the movable reflector and provide support to the movable reflector. The deformable elements can provide a restoring force that biases the movable reflector to a resting position. The IMOD can include one or more restoring force modifiers that are configured to increase the restoring force when engaged. The restoring force modifiers can be between the movable reflector and the deformable elements such that the deformable elements contact the restoring force modifiers when the movable reflector is displaced to a contacting position.

Abstract: This disclosure provides circuits and methods for resetting a movable element, such as a mirror of an interferometric modulator (IMOD), to a consistent starting point or reset position. In one example, a circuit may include three electrodes with a capacitor coupled between two of the electrodes. Additionally, the polarity of one of the electrodes may be configured to switch and reverse in polarity relative to another electrode. Accordingly, the movable element may be moved to a reset position.

Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).