Patents by Inventor Richard Yeh

Richard Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190033242
    Abstract: A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.
    Type: Application
    Filed: July 27, 2018
    Publication date: January 31, 2019
    Inventors: Paulo S. MOTTA, Roberto M. RIBEIRO, Richard YEH
  • Patent number: 9927360
    Abstract: An environmental sensor may include a heat source that heats a metal oxide sensing material. Electrodes may be formed in the metal oxide sensing material that measure the resistance of the metal oxide sensing material to determine the concentration of various gases. The environmental sensor may include an infrared light source that emits infrared light at a given wavelength. An infrared detector and band-pass filter may be used to detect the concentration of a particular gas such as carbon dioxide. In order to reduce power consumption, a heater may act as both the heat source for the metal oxide sensing material and the infrared light source for the infrared detector. The metal oxide sensing material, heater, and infrared detector may be formed in the same enclosure. The enclosure may have an opening that is aligned with an opening in an electronic device housing.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: March 27, 2018
    Assignee: Apple Inc.
    Inventor: Richard Yeh
  • Publication number: 20180059021
    Abstract: An environmental sensor may include a heat source that heats a metal oxide sensing material. Electrodes may be formed in the metal oxide sensing material that measure the resistance of the metal oxide sensing material to determine the concentration of various gases. The environmental sensor may include an infrared light source that emits infrared light at a given wavelength. An infrared detector and band-pass filter may be used to detect the concentration of a particular gas such as carbon dioxide. In order to reduce power consumption, a heater may act as both the heat source for the metal oxide sensing material and the infrared light source for the infrared detector. The metal oxide sensing material, heater, and infrared detector may be formed in the same enclosure. The enclosure may have an opening that is aligned with an opening in an electronic device housing.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 1, 2018
    Inventor: Richard Yeh
  • Patent number: 9850127
    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: December 26, 2017
    Assignee: Apple Inc.
    Inventors: Milind S. Bhagavat, Richard Yeh, Henry H. Yang
  • Publication number: 20170355599
    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
    Type: Application
    Filed: August 4, 2017
    Publication date: December 14, 2017
    Inventors: Milind S. Bhagavat, Richard Yeh, Henry H. Yang
  • Patent number: 9826808
    Abstract: An embodiment of an article of luggage is disclosed, the luggage in one practice having compression and expansion capability comprising an interposed metal frame of split configuration having an expansion portion positioned between the split where the metal frame is attached to one side of the luggage. One of more expansion and locking devices permit compression of contents and also enables locking the luggage in its expanded shape.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: November 28, 2017
    Assignee: Briggs and Riley Travelware, LLC
    Inventors: Herng Fuu Richard Yeh, Georgene Rada, Alan Sticca
  • Patent number: 9796578
    Abstract: An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: October 24, 2017
    Assignee: Apple Inc.
    Inventors: Kuan-Lin Chen, Richard Yeh
  • Patent number: 9751756
    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: September 5, 2017
    Assignee: Apple Inc.
    Inventors: Milind S. Bhagavat, Richard Yeh, Henry H. Yang
  • Publication number: 20160366995
    Abstract: An embodiment of an article of luggage is disclosed, the luggage in one practice having compression and expansion capability comprising an interposed metal frame of split configuration having an expansion portion positioned between the split where the metal frame is attached to one side of the luggage. One of more expansion and locking devices permit compression of contents and also enables locking the luggage in its expanded shape.
    Type: Application
    Filed: July 9, 2015
    Publication date: December 22, 2016
    Applicant: Briggs and Riley Travelware, LLC
    Inventors: Herng Fuu Richard Yeh, Georgene Rada, Alan Sticca
  • Patent number: 9448367
    Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: September 20, 2016
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Stefan J. Murry, Che-Shou (Richard) Yeh
  • Patent number: 9372338
    Abstract: This disclosure provides systems, methods and apparatus relating to electromechanical display devices. In one aspect, a multi-stage interferometric modulator (IMOD) can include a movable reflector that can be moved to different positions to produce different reflected colors. The IMOD can include deformable elements that are coupled to a back side of the movable reflector and provide support to the movable reflector. The deformable elements can provide a restoring force that biases the movable reflector to a resting position. The IMOD can include one or more restoring force modifiers that are configured to increase the restoring force when engaged. The restoring force modifiers can be between the movable reflector and the deformable elements such that the deformable elements contact the restoring force modifiers when the movable reflector is displaced to a contacting position.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: June 21, 2016
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Teruo Sasagawa, Richard Yeh, Kostadin Dimitrov Djordjev, Hrishikesh Vijaykumar Panchawagh
  • Publication number: 20160159638
    Abstract: An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.
    Type: Application
    Filed: September 30, 2014
    Publication date: June 9, 2016
    Inventors: Kuan-Lin Chen, Richard Yeh
  • Publication number: 20160041343
    Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).
    Type: Application
    Filed: October 15, 2015
    Publication date: February 11, 2016
    Inventors: I-Lung HO, Stefan J. MURRY, Che-Shou (Richard) YEH
  • Patent number: 9170383
    Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: October 27, 2015
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Stefan J. Murry, Richard Yeh
  • Publication number: 20150291413
    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
    Type: Application
    Filed: August 4, 2014
    Publication date: October 15, 2015
    Inventors: Milind S. Bhagavat, Richard Yeh, Henry H. Yang
  • Publication number: 20150205092
    Abstract: This disclosure provides systems, methods and apparatus relating to electromechanical display devices. In one aspect, a multi-stage interferometric modulator (IMOD) can include a movable reflector that can be moved to different positions to produce different reflected colors. The IMOD can include deformable elements that are coupled to a back side of the movable reflector and provide support to the movable reflector. The deformable elements can provide a restoring force that biases the movable reflector to a resting position. The IMOD can include one or more restoring force modifiers that are configured to increase the restoring force when engaged. The restoring force modifiers can be between the movable reflector and the deformable elements such that the deformable elements contact the restoring force modifiers when the movable reflector is displaced to a contacting position.
    Type: Application
    Filed: April 29, 2014
    Publication date: July 23, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Teruo Sasagawa, Richard Yeh, Kostadin Dimitrov Djordjev, Hrishikesh Vijaykumar Panchawagh
  • Publication number: 20150070747
    Abstract: This disclosure provides circuits and methods for resetting a movable element, such as a mirror of an interferometric modulator (IMOD), to a consistent starting point or reset position. In one example, a circuit may include three electrodes with a capacitor coupled between two of the electrodes. Additionally, the polarity of one of the electrodes may be configured to switch and reverse in polarity relative to another electrode. Accordingly, the movable element may be moved to a reset position.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 12, 2015
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Edward Keat Leem Chan, Cheonhong Kim, Wilhelmus Johannes R. Van Lier, Bing Wen, Chandra Shekar Reddy Tupelly, Ningning Zhou, Richard Yeh
  • Publication number: 20140161394
    Abstract: A multi-channel optical transceiver includes a multi-channel transmitter optical subassembly (TOSA), a multi-channel receiver optical subassembly (ROSA), and a dual fiber type direct link adapter directly linked to the multi-channel TOSA and the multi-channel ROSA with optical fibers. The dual fiber type direct link adapter is also configured to receive pluggable optical connectors, such as LC connectors, mounted at the end of fiber-optic cables including optical fibers for carrying optical signals to and from the transceiver. The dual fiber type direct link adapter thus provides the optical input and output to the transceiver for the optical signals received by the ROSA and transmitted by the TOSA. The multi-channel optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).
    Type: Application
    Filed: December 10, 2012
    Publication date: June 12, 2014
    Applicant: APPLIED OPTOELECTRONICS, INC.
    Inventors: I-Lung Ho, Stefan J. Murry, Richard Yeh
  • Publication number: 20140037635
    Abstract: Novel IL-17 like polypeptides and nucleic acid molecules encoding the same. The invention also provides vectors, host cells, selective binding agents, and methods for producing IL-17 like polypeptides. Also provided for are methods for the treatment, diagnosis, amelioration, or prevention of diseases with IL-17 like polypeptides, agonists, or antagonists thereof.
    Type: Application
    Filed: June 26, 2013
    Publication date: February 6, 2014
    Applicant: Amgen Inc.
    Inventors: Eugene MEDLOCK, Gary S. ELLIOTT, Shuqian JING, Scott Michael SILBIGER, Hung Q. NGUYEN, Richard YEH
  • Patent number: 8445307
    Abstract: Monolithic IC/MEMS processes are disclosed in which high-stress silicon nitride is used as a mechanical material while amorphous silicon serves as a sacrificial layer. Electronic circuits and micro-electromechanical devices are built on separate areas of a single wafer. The sequence of IC and MEMS process steps is designed to prevent alteration of partially completed circuits and devices by subsequent high process temperatures.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: May 21, 2013
    Assignee: Alces Technology, Inc.
    Inventors: Richard Yeh, David M Bloom