Abstract: Disclosed is a method of manufacturing a high-silicon aluminum alloy electronic packaging shell, which uses high-silicon aluminum alloys with different silicon content as a bottom, transition part(s) and a welding part respectively to form a gradient material structure to meet the comprehensive requirements of electronic packaging materials for material properties such as strength, thermal conductivity, and thermal expansion coefficient, as well as process properties such as machining, surface coating, and laser welding.

Abstract: A composition design optimization method of aluminum alloy for selective laser melting, including the following steps: S1: making alloy ingots with different composition; S2: pre-treating and processing the alloy ingots to obtain alloy sample blocks with different composition; S3: twice laser surface scanning treatment; S4: treating the alloy sample blocks by induction heating and quenching; S5: inspecting surface morphology, microstructure and properties of second laser melting layer of each alloy sample block, to determine whether the alloy sample blocks are suitable for selective laser melting process and optimize alloy composition.