Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract: An integrated circuit contains within the chip one or more measuring devices that provide a digital value corresponding to respective physical operating parameters of the chip. The digital values can be communicated to other devices using an interrupt handler.

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract: This invention relates to digitally measuring operating parameters, for example, temperature, within a semiconductor chip and making those measurements internally available to hardware, firmware, and software.

Abstract: This invention relates to digitally measuring operating parameters, for example, temperature, within a semiconductor chip and making those measurements internally available to hardware, firmware, and software.

Abstract: A scanning imager is described which includes a line camera and a table to mechanically present successive regions of an item to be imaged. The time of exposure of the camera for each successive region presented is controlled by encoding strips connected to the table. Thus, if the table is subjected to motion variations, the encoding strips are likewise affected and vary the exposure time for each analog image pixel scan. To compensate, an exposure correction system is provided which includes an analog voltage generator whose output is related to each successive region exposure time. An A to D conversion circuit is responsive to the analog voltage to normalize the analog image value from the camera so that, in effect, equal exposure images result.