Patents by Inventor Rick A. Wilcox

Rick A. Wilcox has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240030946
    Abstract: An aspect of the disclosure relates to a user equipment (UE) including: at least one antenna; a transceiver coupled to the at least one antenna, wherein the transceiver comprises: a resonator oscillator configured to generate a resonator signal; and a temperature sensor configured to generate a temperature signal related to a temperature of the resonator oscillator; an applications processor coupled to the transceiver; and a resonator field calibrator coupled to the applications processor and the transceiver.
    Type: Application
    Filed: July 20, 2022
    Publication date: January 25, 2024
    Inventors: Rick WILCOX, Troy CURTISS, Joseph MAALOUF, Mohammed TAWASHI
  • Patent number: 10243569
    Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Rick A. Wilcox, Daniel F. Filipovic, Xu Mike Chi, Chris M. Rosolowski
  • Publication number: 20160197617
    Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
    Type: Application
    Filed: December 28, 2015
    Publication date: July 7, 2016
    Inventors: Rick A. Wilcox, Daniel F. Filipovic, Xu Mike Chi, Chris M. Rosolowski
  • Patent number: 9252782
    Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: February 2, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Rick A. Wilcox, Daniel F. Filipovic, Xu Mike Chi, Chris M. Rosolowski
  • Publication number: 20120209558
    Abstract: An apparatus includes a temperature measuring device within a thermally conductive package. A crystal within the package is thermally coupled to the temperature measuring device and subjected to a same temperature as the temperature measuring device. A controller external to the package is configured to receive a signal from the crystal and a temperature measurement from the temperature measuring device. The controller is configured to estimate a frequency error of the crystal based on the temperature measurement and to provide a frequency error estimate to an external system.
    Type: Application
    Filed: January 9, 2012
    Publication date: August 16, 2012
    Applicant: QUALCOMM INCORPORATED
    Inventors: Rick A. Wilcox, Daniel F. Filipovic, Xu Mike Chi, Chris M. Rosolowski